Company History
2013
SoMs (system on modules) with 8 Gbit DDR3 SDRAM, 4 Gbyte eMMC, 32 Mbyte SPI Flash, RTC, Gigabit Ethernet, and USB in a uniform 4×5 cm compact format:
- Trenz Electronic TE0710 series: Artix-7 FPGA, low-cost module with DDR3 SDRAM;
- Trenz Electronic TE0711 series: Artix-7 FPGA, optimized for high I/O count;
- Trenz Electronic TE0720 series: with Zynq-7000 SoC, connecting a dual-core ARM Cortex-A9 CPU and a 28 nm FPGA in a single device;
- Trenz Electronic TE0770 series: Kintex-7 FPGA, offering much DSP power and four 12.5 Gbit/s high-performance transceivers at the best price-performance ratio.

- Trenz Electronic TE0710

- Trenz Electronic TE0711

- Trenz Electronic TE0720

- Trenz Electronic TE0770

- Trenz Electronic becomes Xilinx Alliance Partner - Certified Member.
2011
- Trenz Electronic TE0630 series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (USB 2.0 configuration and data communication, 32-bit DDR SDRAM, SPI Flash, mechanically and largely electrically compatible with Trenz Electronic TE0300).
- Partnership with TED (Tokyo Electron Device, Japan) for distribution and support of their high-end inrevium FPGA boards and kits.
- Partnership with VeeaR (Austria) for distribution and support of their boards and kits for voice recognition and voice control.
- Partnership with Eikon (Italy) for distribution and support of their boards and open source embedded platform OpenPicus for the internet of things.
- Partnership with Epiq Solutions (USA) for distribution and support of their SDR (software defined radio) and CR (cognitive radio) boards and open source platforms.
- Partnership with NGX Technology (India) for distribution and support of their MCU boards and kits.
2010
- Partnership with Tokushu Denshi Kairo (Japan) for distribution and support of their Xilinx Spartan-6 FPGA modules with USB 2.0 (configuration, communication, JTAG).
- Trenz Electronic GigaBee XC6SLX (TE0600) series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (gigabit Ethernet data communication, 32-bit DDR SDRAM, SPI Flash).
- Partnership with PoLabs (Slovenia) for distribution and support of their USB interfaces modules.
- Trenz Electronic becomes German branch and European agent of SytemBase (South Korea).
- Partnership with GlobalTop Technology (Taiwan) for distribution and support of their GPS and RF products.
- Development of a verification system based on Atmark Techno Suzaku.
2009
- Partnership with Mirifica (Italy) for distribution and support of Trenz Electronic products in Italy.
- Development of a PCIe backplane.
- Trenz Electronic TE0320: Xilinx Spartan-3A DSP industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, 32-bit DDR SDRAM, SPI Flash).
- Partnership with Digilent (USA) for distribution and support of its digital design products.
2008
- Development of a PCIe board with 4 channel x 10-bit x 1.25 Gsps per channel ADC (maximum sampling rate of 5 Gsps) based on a Xilinx Virtex-5 FX30 FPGA.
- Development of an interface between a power plant and an industrial computer.
- Development of an FPGA-based control system for laser exposure of printing plates.
- Trenz Electronic TE0300: Xilinx Spartan-3E industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, DDR SDRAM, SPI Flash).
2007

- Xilinx Alliance Program
- Trenz Electronic becomes Xilinx Alliance Partner.
- Development of a pulse measurement system with fiber optic synchronization and 16-bit 125 Msps ADCs.
- Partnership with SystemBase (South Korea) for the distribution and support of their Eddy series.
- Partnership with Simple Solutions (Germany)
2006
2005
- Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include SDRAM.
- Development of a memory card reader with USB interface.
- Partnership with OHO-Elektronik (Germany) for the distribution and support of their DIL (dual in-line) FPGA and CPLD mini-modules.
- Begin of distribution of standard Xilinx (USA) evaluation boards and kits.
- Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include a 40 Msps 12-bit ADC.
- Development of an evaluation board for a dual-core ARM ASIC.
- Partnership with Trycom (Taiwan) for the distribution and support of their industrial serial converters.
- Partnership with Atmark Techno (Japan) for the distribution and support of their Suzaku series, an FPGA Module with CPU and Linux preloaded.
2004
- Development of an X/Y automatic wiring machine.
- Partnership with embeddedCL (Chile) for the distribution of ARMermelator development board (Atmel AT91M42800A ARM7TDMI microcontroller + Xilinx Spartan-IIE FPGA) that, although short-lived, gained widespread acceptance in the embedded community.
- Trenz Electronic TE-XC3S (TE0140): Xilinx Spartan-3 FPGA micromodule (USB 2.0, EEPROM, platform Flash for in-system configuration)
2002
- Trenz Elektronik personal undertaking is converted to Trenz Electronic GmbH limited liability company in order to face new challenges.
- Development of a control system for high vacuum plasma cleaning.
- Development of a control system for concrete coloring.
- Trenz Electronic TE-XC2SE (TE0126): Xilinx Spartan-IIE FPGA development system (featuring SRAM and Flash PROM, configurable through USB).
2001
2000
- Development of different 19" level converter cards for industrial applications (24 V -> 5 V and 5V -> 24 V)
- Partnership with Omron Electronics for distribution and support of their industrial automation products.
1992
- Foundation of Trenz Elektronik as an electronic engineering office (personal undertaking).















