Inrevium Xilinx Virtex-6 FPGA Entwicklungs Board
Overview
Inrevium Virtex-6 FPGA Boards are built with the right mix of programmability, integrated blocks for DSP, memory, and connectivity support - including high-speed transceiver capabilities - to satisfy the insatiable demand for higher bandwidth and higher performance.
Large Capacity Extendable PCI Express Gen2 Platform
The inrevium TB-6V-LX240T, LX550T, and SX475T-PCIEXP make ideal evaluation platforms for the development of high-performance graphics engines for next-generation televisions and multi-function printers, or for the high-speed arithmetic processing found in high-performance computing applications. Fitted with industry-leading, high-capacity, Virtex-6 LXT or Virtex-6 SXT FPGA family devices, the standard platform delivers both exceptional performance via 8-lane PCI Express Gen 2 interface and 2-channel 1,066 Mbps DDR3 SDRAM SO-DIMM high-speed memory interfaces and rapid evaluation of wide-bandwidth and high-speed data transfer systems.
Features
- Xilinx Virtex-6: XC6V LX240T / LX550T / SX475T-2FFG1759
- 2 x DDR3 SDRAM SO-DIMM connectors (1 Gbyte SO-DIMM modules supplied)
- Configuration from micro SD card
- High-speed configuration from on-board NAND flash memory
- PCI Express x8 (Gen 2 supported) LX550T device support Gen2 x4
- FMC HPC connector (LX240T FPGA 8-lane, LX550T / SX475T FPGA 10-lane)
- MMCX clock input
- SPI flash (128 Mbit)
- External PLL
- RS-232 (UART)
- 2 x FMC HPC (High Pin Count)
- 1 x FMC LPC (Low Pin Count) (can only be used with Virtex-6 LX550T or SX475T FPGA)
- 4 push button switches
- 8 LEDs
- 8 DIP switches
- 10-pin general-purpose pin header
- Power supply
- Board size: 130 x 300 mm
- High-speed DDR3 SDRAM SO-DIMM interface design
- PCI Express DMA design
High-Density Scalable ASIC Prototyping Platform
The inrevium TB-6V-LX760-LSI incorporates a Virtex-6 LX760 FPGA which features maximum density, high speed internal logic and high bandwidth interface. These features allow the TB-6V-LX760-LSI to combine higher bandwidth and performance with lower power consumption. With high-speed memory (DDR3 SDRAM 1066 Mbps) and a USB interface included as standard features together with support for a DDR memory controller and the standard DDR PHY interface (DFI), the new TB-6V-LX760-LSI is an ideal test platform for developing the LSIs that will serve as the core device in products featuring the next generation of high-quality image processing engines or video and communications control engines.
Features
- Xilinx FPGA: XC6VLX760-2FFG1760 device
- 4 x DDR3 SDRAM 1 Gbit
- BPI flash 256 Mbit
- SPI flash 64 Mbit
- Configuration from SD card
- Interface: USB 2.0, I2C
- 10 x FMC LPC (low pin count) connectors
- 4 x Push button switches
- 16 x LED
- 8 x DIPO switches
- Power supply
- High-speed DDR3 SDRAM SO-DIMM interface design