Xilinx Alliance Program

Trenz Electronic GmbH is an official member of the Xilinx Alliance Program.

 

Digilent Inc.

Trenz Electronic GmbH is the European partner and an official distributor of
Digilent Inc. USA.

 

Fork me on github!

Fork us on GitHub!

 

Embedded World 2011

 

Visit us at Embedded World 2012 in Nuremberg (Germany)!
February 28 to March 01, 2012. Hall 1,  booth 1-107

Standard FPGA Micromodules (TE0140 Series)

Overview

The low-cost micromodule features a modern Spartan-3 FPGA. With small size and high-density connectors, the FPGA modules are designed as a ready-to-use plug-in for carrier boards. Select one of the available carrier boards, design your own, or hire Trenz Electronic for a customized carrier.

The tiny 50.7 x 43.6 mm PCB integrates perfectly in battery-powered, hand-held or USB-powered applications.

Features

  • Spartan-3 FPGA
  • Platform Flash: 1 Mbit to 4 Mbit
  • USB 2.0 Interface: USB 3250 PHY (60 MHz internal clock)
  • Power supply via USB or external 5 Volt input

Available Models

Models

TE0140L

TE0140

TE0140B

TE0140B5

TE0146 with SDRAM

FPGA

Spartan-3
XC3S200- 4FTG256C

Spartan-3
XC3S400-
4FTG256C

Spartan-3
XC3S1000-
4FTG256C

Spartan-3
XC3S1000-
5FTG256C

Spartan-3
XC3S1000-
4FTG256C

Gates

200K

400K

1000K

1000K

1000K

Block RAM

216 Kbit

288 Kbit

432 Kbit

432 Kbit

432 Kbit

Platform Flash

1 Mbit

2 Mbit

4 Mbit

4 Mbit

4 Mbit

user I/Os

120

120

120

120

55

LEDs

1

 

Push Buttons

1

1

1

1

No

EEPROM

16 Kbit

16 Kbit

16 Kbit

16 Kbit

No

SDRAM

No

No

No

No

MT48LC2M32
64 Mbit

B2B Connectors

2x80 pin

2x80 pin

2x80 pin

2x80 pin

1x80 pin

Dimensions  (mm)

50.7x43.6

50.7x43.6

50.7x43.6

50.7x43.6

50.7x43.6

Order now

TE0143 Prototyping Carrier Board

TE0143 Prototyping Carrier Board

Overview

The carrier board provides low-cost connection and extension of the Spartan-3 Micromodule. A low-cost plug & play solution for FPGA prototyping.

Features

  • All signals available on header w. 2.54mm (100mil) pitch
  • Board supply via DC jack or USB
  • JTAG header
  • Small form factor: 115x72mm

Resources

PDF Micromodule Product Brief (710 KB 31.08.11)

PDF Micromodule user's Manual (894 KB 31.08.11)

PDF SDRAM Micromodule user's Manual (539 KB 31.08.11)

 

Please visit our  download area  for more information.

Micromodules in the Webshop

News:

Trenz Electronic announces a distribution agreement with demmel products

Demmel products is an innovative leading manufacturer of "Next Generation Intelligent LCD" (iLCD)...

GlobalTop Technology unveils the new PA6H low-profile GPS module

PA6H is a 4.7 mm thick GPS module with latest MediaTek MT3339 chip and integrated internal/external...

Joint Development of Inrevium and Cypress Semiconductor for USB 3.0 Device Interface Card

Use of flexible ultra-high-speed USB 3.0 controller accelerates development innovation in systems...

Xilinx Making Immersive 3D and 4K2K Displays Possible with 7 Series FPGA System Integration

Industry's First 4K2K FPGA Implementation at CES Highlights Xilinx Design Platforms for Bringing...

Digilent Announces New Pmod Enabling Arduino/Digilent Interface

Pullman, Washington, USA Digilent has announced expanded capabilities for the chipKIT development...