Trenz Electronic is on tour this spring!
We
will be attending the FPGA Horizons US East event in Worcester on
April 29 and 30. The show features a selection of cutting-edge
discussions on FPGA and SoC design today and in the future, presented
by leading experts.
Visit us at booth 606.
Our
demos during the conference are our TE0950 AMD Versal AI Edge and the
TE0835 RFSoC-Modul mit AMD Zynq™ UltraScale+™ . Product
highlights are the Versal Gen2 und Spartan Ultrascale+, a new
generation FPGA Modules.
Our subsequent exhibitions will be during the AMD Embedded Computing Summit 2026 (ECS) in North America in
San Jose (on May 5 and 6)
Washington D.C. (May 07 and 08)
Longmont (May 12 and 13)
Thomas Brünger, COO of Trenz Electronic, will give a presentation at all three conferences under the title „Development & Customs paths“. ECS is AMD’s premier in-person event series for engineers building next-generation embedded systems.
Trenz shows several new modules on the CERN FPGA Developers Forum
(FDF) in Genf. The 3rd edition of the FDF is a platform to discuss
and exchange information, experiences, implementation ideas, tips,
and tricks as well as challenges faced with design tools and specific
FPGA technologies.
During these days our developer Martin
Rohrmüller will give a presentation.
The event will take place
from May 27th to 29th.
Meet our experts during the upcoming conferences.
We would
be pleased if you get in touch with us!