Trenz Electronic Industrial FPGA Micromodules
TE0300 Series
The FPGA Micromodule integrates a leading-edge Spartan-3E FPGA, a USB 2.0 microcontroller, DDR Ram, configuration Flash and power supply on a tiny footprint. A large number of configurable I/Os are provided via shock proof B2B mini-connectors.
It is intended to be used as a ready to use OEM board, or can be combined with our carrier boards. The module serves as a powerful system widely used for educational and research activities.
Boards with other configurations, or equipped with industrial temperature grade parts are available on request.
Software for SPI Flash programming over USB, as well as reference designs for high speed data transfer over USB are included.
Key Features
- Small form factor (smaller than half a credit card!)
- Ruggedized design
- Higly versatie
- x16 DDR with up to 666 MByte/s bandwidth
- 3 on-board DC-DC converters for high efficiency
Specification
- Xilinx Spartan-3E XC3S500E to XC3S1600E FPGA
- Cypress FX2 USB 2.0 CY7C68013A-56LFXC microcontroller
- 16 Mbit to 64 Mbit SPI Flash for configuration and user data
- up to 512 MBit DDR RAM
- 16 kbit I2C EEPROM
- 104 I/Os + 6 inputs
- Power supply via USB bus or B2B (board-to-board) 5 V DC
- Programming is implemented via JTAG, SPI or USB. (The required adapter is not included)
- 2x80-pin Hirose DF17 B2B Connectors
- 1 LED
- 1 push button
- Size only 40.5mm x 47.5mm
TE0300 Series Overview Chart
model | gates | block-RAM | clock | DDR RAM | temp. |
|---|---|---|---|---|---|
TE0300-01M | 1.2 | 504 | 125 | 512 | comm. |
TE0300-01BM | 1.6 | 648 | 125 | 512 | comm. |
TE0300-01BMLP | 1.6 | 648 | 100 | 512 | comm. |
TE0300-01NR | 1.2 | 504 | 125 | - | comm. |
TE0300-01I | 1.2 | 504 | 125 | 512 | ind. |
TE0300-01IBM | 1.6 | 648 | 125 | 512 | ind. |
TE0300-01IBMLP | 1.6 | 648 | 100 | 512 | ind. |
abbreviations:
- comm. = commercial grade temperature
- ind. = industrial grade temperature
