Trenz Electronic History

2017

  • Cooperation with Arrow Electronics
    • TEI0001: MAX1000 FPGA IoT/Maker board with Intel MAX 10 FPGA, 8 or 16 kLE, up to 32 MByte SDRAM, 64 MBit Flash
    • TEI0003: CYC1000 FPGA module with Intel Cyclone 10 LP, 25 kLE, 8 MByte SDRAM, 2 MByte Flash
    • TEI0004: ARROW USB Programmer2 for development with Intel FPGAs
    • TEI0005: FPGA Programmer2 SMD module, FT2232H based JTAG programmer supported by Intel Quartus
    • TEI0010 AnalogMAX: Sensor Fusion board with Intel MAX 10 FPGA and integrated smoke detector and temperature sensor
    • TEM0001 SMF2000: FPGA module with Microsemi SmartFusion2, 8 MByte SDRAM, 8 MByte QSPI Flash
    • TEM0002 SmartBerry: FPGA module with Microsemi SmartFusion2 M2S010 SoC, Raspberry Pi 2 Formfaktor, 128 MByte DDR3, 1 GBit Ethernet PHY
    • TEL0001 LXO2000: FPGA module with Lattice XO2-4000, On-Board USB/JTAG, On-Board USB/serial, 100 MHz MEMS oscillator
    • TEO0001 RSL1000: Arrow OnSemi BT5.0 IoT-Board, RSL10 SoC, Bluetooth 5 certified, integrated on-board J-Link debugger
  • Trenz Electronic EDDP Motor Control Kit with Motor & Power Supplies - enables development and evaluation of 3-phase motor control applications
  • Trenz Electronic FMC Carrier TEC0330 und TEF1001: Xilinx Virtex-7 or Kintex-7 FPGA, 8 resp. 4 Lane PCIe GEN2, DDR3 SODIMM
  • Trenz Electronic TEP0002: Pmod compatible motor driver board for developing BLCD or CD motor driving software.
  • Trenz Electronic TE0876 Serie: IceZero mit Lattice ICE40HX FPGA, Open Source, plattform for RaspberryPi with 4 MBit ext. SRAM and four 2x6 Pmod connectors
  • Trenz Electronic TE0807 Serie: Xilinx Zynq UltraScale+, 900 Pin Packages, 4 GByte DDR4, 128 MByte Flash, serial transceiver 4 x GTR und 16 x GTH
  • Trenz Electronic TE0724 Serie: Xilinx Zynq-7010 or -7020, 1 GByte DDR3L, 32 MByte SPI Flash, 1 GBit Ethernet, 6 x 4 cm form factor
  • Trenz Electronic TEB0911 Serie: UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ ZU9, 6 FMC connectors
  • Trenz Electronic TE0803 Serie: Xilinx Zynq UltraScale+, 784 Pin Packages, up to 4 GByte DDR4, up to 256 MByte Flash, GPU und VCU depending on model, 5,2 x 7,6 cm form factor
  • Single Core SoMs: TE0715, TE0720, TE0722, TE0723, TE0726 now also available with Xilinx Zynq-7000 Single-Core ARM Cortex-A9
  • Starter Kits: TE0720, TE0729, TE0803, TE0808 SoCs/MPSoCs with compatible carrier board and heat sink/heat spreader, partly pre-assembled in an enclosure, including accessories

2016

  • Trenz Electronic TE0820 series: Xilinx Zynq UltraScale+, Pin Packages 784, up to 2 GByte DDR4, up to 128 MByte Flash, GPU and VCU depending on model, 4 x 5 cm form factor
  • Trenz Electronic TE0713 series: Xilinx Artix-7 100T/200T, 1 GByte DDR3L, 32 MByte SPI Flash, 4 x 5 form factor
  • Trenz Electronic TEP0001: Pmod-Compatible CAN-FD transceiver
  • TE0887 icoBoard: Open-Source ICE40 FPGA board, 8k LUT, 16 MByte Flash, 64 MBit HyperRAM, 4 Pmod connectors
  • Trenz Electronic's FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics, worldwide distribution.
  • Trenz Electronic TE0714 series: Xilinx Artix-7, just 4 x 3 cm form factor, 16 MByte QSPI Flash, 4 x GTP, 2 x 100 pin B2B connectors
  • Trenz Electronic TE0745 series: Xilinx Zynq-7030, -7035 and -7045, 1 GByte DDR3, 32 MByte Flash, 1GBit Ethernet PHY, USB 2.0 OTG
  • Trenz Electronic "UltraSOM+" TE0808 series: Xilinx Zynq UltraScale+, 900 Pin Packages, DDR4, Flash, 20 x Gigabit Transceiver
  • Trenz Electronic TE0841 series: Xilinx Kintex UltraScale, KU35/KU40, DDR4, 8 x Transceiver, 4 x 5 cm form factor

2015

  • Trenz Electronic TE0790 series: universal USB adapter with 2 channels based on FTDI FT2232H USB2 HS interface chip
  • Trenz Electronic TE0728 series: automotive Xilinx Zynq-7020, 512 MByte DDR3 SDRAM, 16 MByte SPI Flash und 2 x 100 MBit Ethernet
  • Trenz Electronic TE0729 series: Xilinx Zynq-7020, 512 MByte DDR3 SDRAM, 32 MByte Flash, 3 x Ethernet, RTC, 5 x 7 cm form factor
  • Trenz Electronic TE0782 series: Xilinx Zynq-7045, Zynq 1000, 1 GByte DDR3 SDRAM, 32 MByte Flash, Ethernet, RTC, optional 2 x 8 MByte HyperRAM
  • Trenz Electronic TE0725 series: Artix-7, 15T bis 100T, 32 MByte Flash, 2 x 50 Pin mit 2,54 pitch, 87 I/O's
  • Trenz Electronic "ZynqBerry" TE0726 series: Xilinx Zynq Z-7010, 512 MByte DD3L, 16 MByte Flash, 4 USB-Anschlüsse, Rasberry Pi Model 2 form factor
  • Trenz Electronic "ArduZynq" TE0723 series: Xilinx Zynq Z-7010, 128/512 MByte DDR SDRAM, 16 MB Flash, Arduino form factor
  • Trenz Electronic TE0722 series: Xilinx Zynq-7010, 16 MByte SPI Flash, DIP 40, 1,8 x 5,1 cm form factor
  • SMD inhouse manufacturing
  • Enhancement of Production-, Office and Developer-Team, new bureaus directly near production
  • Partnership with Red Pitaya (Slovenien) for distribution and support of their boards and kits (Starter-Kit, Diagnostic-Kit)
  • Partnership with SoC-e (System-on-Chip engineering) for distribution and support of their SMARTZynq modules and carrier boards
  • Partnership with MYIR (Make Your Ideas Real) for distribution and support of their Zynq boards and kits
  • Partnership with Sundance (UK) for distribution and support of their carrier boards, which also can be implemented with our modules

2014

  • Trenz Electronic TE0715 series: Xilinx Zynq-7015/Zynq-7030 SoC, 1 GByte DDR SDRAM, 32 MByte Flash, Ethernet, 4 x Transceiver, 4 x 5 cm form factor
  • Trenz Electronic TE0741 series: Xilinx Kintex-7 FPGA, XC7K70T to XC7K410T, 32 MByte SPI Flash, 8 MGT's

2013

SoMs (system on modules) with 8 GBit DDR3 SDRAM, 4 GByte eMMC, 32 MByte SPI Flash, RTC, Gigabit Ethernet, and USB in a uniform 4 x 5 cm compact form factor:

  • Trenz Electronic TE0710 series: Xilinx Artix-7 FPGA, low-cost module with DDR3 SDRAM;
  • Trenz Electronic TE0711 series: Xilinx Artix-7 FPGA, optimized for high I/O count;
  • Trenz Electronic TE0720 series: Xilinx Zynq-7000 SoC, connecting a dual-core ARM Cortex-A9 CPU and a 28 nm FPGA in a single device;
  • Trenz Electronic TE0770 series: Xilinx Kintex-7 FPGA, offering much DSP power and four 12.5 GBit/s high-performance transceivers at the best price-performance ratio.
  • Trenz Electronic becomes Xilinx Alliance Partner - Certified Member.

2011

  • Trenz Electronic TE0630 series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (USB 2.0 configuration and data communication, 32-bit DDR SDRAM, SPI Flash, mechanically and largely electrically compatible with Trenz Electronic TE0300).
  • Partnership with TED (Tokyo Electron Device, Japan) for distribution and support of their high-end inrevium FPGA boards and kits.
  • Partnership with VeeaR (Austria) for distribution and support of their boards and kits for voice recognition and voice control.
  • Partnership with Eikon (Italy) for distribution and support of their boards and open source embedded platform OpenPicus for the internet of things.
  • Partnership with Epiq Solutions (USA) for distribution and support of their SDR (software defined radio) and CR (cognitive radio) boards and open source platforms.
  • Partnership with NGX Technology (India) for distribution and support of their MCU boards and kits.

2010

  • Partnership with Tokushu Denshi Kairo (Japan) for distribution and support of their Xilinx Spartan-6 FPGA modules with USB 2.0 (configuration, communication, JTAG).
  • Trenz Electronic GigaBee XC6SLX (TE0600) series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (gigabit Ethernet data communication, 32-bit DDR SDRAM, SPI Flash).
  • Partnership with PoLabs (Slovenia) for distribution and support of their USB interfaces modules.
  • Trenz Electronic becomes German branch and European agent of SytemBase (South Korea).
  • Partnership with GlobalTop Technology (Taiwan) for distribution and support of their GPS and RF products.
  • Development of a verification system based on Atmark Techno Suzaku.

2009

  • Partnership with Mirifica (Italy) for distribution and support of Trenz Electronic products in Italy.
  • Development of a PCIe backplane.
  • Trenz Electronic TE0320: Xilinx Spartan-3A DSP industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, 32-bit DDR SDRAM, SPI Flash).
  • Partnership with Digilent (USA) for distribution and support of its digital design products.

2008

  • Development of a PCIe board with 4 channel x 10-bit x 1.25 Gsps per channel ADC (maximum sampling rate of 5 Gsps) based on a Xilinx Virtex-5 FX30 FPGA.
  • Development of an interface between a power plant and an industrial computer.
  • Development of an FPGA-based control system for laser exposure of printing plates.
  • Trenz Electronic TE0300: Xilinx Spartan-3E industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, DDR SDRAM, SPI Flash).

2007

  • Trenz Electronic becomes Xilinx Alliance Partner.
  • Development of a pulse measurement system with fiber optic synchronization and 16-bit 125 Msps ADCs.
  • Partnership with SystemBase (South Korea) for the distribution and support of their Eddy series.
  • Partnership with Simple Solutions (Germany)

2006

  • Development of a fiber optic router with 14 serial fiber ports based on a Xilinx Virtex-4 FX60 FPGA.
  • Development of scanner electronics with 48 channel x 12 bit x 40 Msps per channel ADC based on a Xilinx Virtex-4 LX25 FPGA.

2005

  • Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include SDRAM.
  • Development of a memory card reader with USB interface.
  • Partnership with OHO-Elektronik (Germany) for the distribution and support of their DIL (dual in-line) FPGA and CPLD mini-modules.
  • Begin of distribution of standard Xilinx (USA) evaluation boards and kits.
  • Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include a 40 Msps 12-bit ADC.
  • Development of an evaluation board for a dual-core ARM ASIC.
  • Partnership with Trycom (Taiwan) for the distribution and support of their industrial serial converters.
  • Partnership with Atmark Techno (Japan) for the distribution and support of their Suzaku series, an FPGA module with CPU and Linux preloaded.

2004

  • Development of an X/Y automatic wiring machine.
  • Partnership with embeddedCL (Chile) for the distribution of ARMermelator development board (Atmel AT91M42800A ARM7TDMI microcontroller + Xilinx Spartan-IIE FPGA) that, although short-lived, gained widespread acceptance in the embedded community.
  • Trenz Electronic TE-XC3S (TE0140): Xilinx Spartan-3 FPGA micromodule (USB 2.0, EEPROM, platform Flash for in-system configuration)

2002

  • Trenz Electronic personal undertaking is converted to Trenz Electronic GmbH limited liability company.
  • Development of a control system for high vacuum plasma cleaning.
  • Development of a control system for concrete coloring.
  • Trenz Electronic TE-XC2SE (TE0126): Xilinx Spartan-IIE FPGA development system (featuring SRAM and Flash PROM, configurable through USB).

2001

  • Trenz Electronic TE-XC2S (TE0115): Xilinx Spartan-II FPGA development system (configurable with parallel cable, expandable by peripheral modules).
  • Development of a frame-grabber for infrared cameras.

2000

  • Development of different 19" level converter cards for industrial applications (24 V -> 5 V and 5V -> 24 V)
  • Partnership with Omron Electronics for distribution and support of their industrial automation products.

1992

Foundation of Trenz Electronic as an electronic engineering office (personal undertaking).

2017 Cooperation with  Arrow Electronics TEI0001 : MAX1000 FPGA IoT/Maker board with Intel MAX 10 FPGA, 8 or 16 kLE, up to 32 MByte SDRAM, 64 MBit Flash TEI0003... read more »
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Trenz Electronic History

2017

  • Cooperation with Arrow Electronics
    • TEI0001: MAX1000 FPGA IoT/Maker board with Intel MAX 10 FPGA, 8 or 16 kLE, up to 32 MByte SDRAM, 64 MBit Flash
    • TEI0003: CYC1000 FPGA module with Intel Cyclone 10 LP, 25 kLE, 8 MByte SDRAM, 2 MByte Flash
    • TEI0004: ARROW USB Programmer2 for development with Intel FPGAs
    • TEI0005: FPGA Programmer2 SMD module, FT2232H based JTAG programmer supported by Intel Quartus
    • TEI0010 AnalogMAX: Sensor Fusion board with Intel MAX 10 FPGA and integrated smoke detector and temperature sensor
    • TEM0001 SMF2000: FPGA module with Microsemi SmartFusion2, 8 MByte SDRAM, 8 MByte QSPI Flash
    • TEM0002 SmartBerry: FPGA module with Microsemi SmartFusion2 M2S010 SoC, Raspberry Pi 2 Formfaktor, 128 MByte DDR3, 1 GBit Ethernet PHY
    • TEL0001 LXO2000: FPGA module with Lattice XO2-4000, On-Board USB/JTAG, On-Board USB/serial, 100 MHz MEMS oscillator
    • TEO0001 RSL1000: Arrow OnSemi BT5.0 IoT-Board, RSL10 SoC, Bluetooth 5 certified, integrated on-board J-Link debugger
  • Trenz Electronic EDDP Motor Control Kit with Motor & Power Supplies - enables development and evaluation of 3-phase motor control applications
  • Trenz Electronic FMC Carrier TEC0330 und TEF1001: Xilinx Virtex-7 or Kintex-7 FPGA, 8 resp. 4 Lane PCIe GEN2, DDR3 SODIMM
  • Trenz Electronic TEP0002: Pmod compatible motor driver board for developing BLCD or CD motor driving software.
  • Trenz Electronic TE0876 Serie: IceZero mit Lattice ICE40HX FPGA, Open Source, plattform for RaspberryPi with 4 MBit ext. SRAM and four 2x6 Pmod connectors
  • Trenz Electronic TE0807 Serie: Xilinx Zynq UltraScale+, 900 Pin Packages, 4 GByte DDR4, 128 MByte Flash, serial transceiver 4 x GTR und 16 x GTH
  • Trenz Electronic TE0724 Serie: Xilinx Zynq-7010 or -7020, 1 GByte DDR3L, 32 MByte SPI Flash, 1 GBit Ethernet, 6 x 4 cm form factor
  • Trenz Electronic TEB0911 Serie: UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ ZU9, 6 FMC connectors
  • Trenz Electronic TE0803 Serie: Xilinx Zynq UltraScale+, 784 Pin Packages, up to 4 GByte DDR4, up to 256 MByte Flash, GPU und VCU depending on model, 5,2 x 7,6 cm form factor
  • Single Core SoMs: TE0715, TE0720, TE0722, TE0723, TE0726 now also available with Xilinx Zynq-7000 Single-Core ARM Cortex-A9
  • Starter Kits: TE0720, TE0729, TE0803, TE0808 SoCs/MPSoCs with compatible carrier board and heat sink/heat spreader, partly pre-assembled in an enclosure, including accessories

2016

  • Trenz Electronic TE0820 series: Xilinx Zynq UltraScale+, Pin Packages 784, up to 2 GByte DDR4, up to 128 MByte Flash, GPU and VCU depending on model, 4 x 5 cm form factor
  • Trenz Electronic TE0713 series: Xilinx Artix-7 100T/200T, 1 GByte DDR3L, 32 MByte SPI Flash, 4 x 5 form factor
  • Trenz Electronic TEP0001: Pmod-Compatible CAN-FD transceiver
  • TE0887 icoBoard: Open-Source ICE40 FPGA board, 8k LUT, 16 MByte Flash, 64 MBit HyperRAM, 4 Pmod connectors
  • Trenz Electronic's FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics, worldwide distribution.
  • Trenz Electronic TE0714 series: Xilinx Artix-7, just 4 x 3 cm form factor, 16 MByte QSPI Flash, 4 x GTP, 2 x 100 pin B2B connectors
  • Trenz Electronic TE0745 series: Xilinx Zynq-7030, -7035 and -7045, 1 GByte DDR3, 32 MByte Flash, 1GBit Ethernet PHY, USB 2.0 OTG
  • Trenz Electronic "UltraSOM+" TE0808 series: Xilinx Zynq UltraScale+, 900 Pin Packages, DDR4, Flash, 20 x Gigabit Transceiver
  • Trenz Electronic TE0841 series: Xilinx Kintex UltraScale, KU35/KU40, DDR4, 8 x Transceiver, 4 x 5 cm form factor

2015

  • Trenz Electronic TE0790 series: universal USB adapter with 2 channels based on FTDI FT2232H USB2 HS interface chip
  • Trenz Electronic TE0728 series: automotive Xilinx Zynq-7020, 512 MByte DDR3 SDRAM, 16 MByte SPI Flash und 2 x 100 MBit Ethernet
  • Trenz Electronic TE0729 series: Xilinx Zynq-7020, 512 MByte DDR3 SDRAM, 32 MByte Flash, 3 x Ethernet, RTC, 5 x 7 cm form factor
  • Trenz Electronic TE0782 series: Xilinx Zynq-7045, Zynq 1000, 1 GByte DDR3 SDRAM, 32 MByte Flash, Ethernet, RTC, optional 2 x 8 MByte HyperRAM
  • Trenz Electronic TE0725 series: Artix-7, 15T bis 100T, 32 MByte Flash, 2 x 50 Pin mit 2,54 pitch, 87 I/O's
  • Trenz Electronic "ZynqBerry" TE0726 series: Xilinx Zynq Z-7010, 512 MByte DD3L, 16 MByte Flash, 4 USB-Anschlüsse, Rasberry Pi Model 2 form factor
  • Trenz Electronic "ArduZynq" TE0723 series: Xilinx Zynq Z-7010, 128/512 MByte DDR SDRAM, 16 MB Flash, Arduino form factor
  • Trenz Electronic TE0722 series: Xilinx Zynq-7010, 16 MByte SPI Flash, DIP 40, 1,8 x 5,1 cm form factor
  • SMD inhouse manufacturing
  • Enhancement of Production-, Office and Developer-Team, new bureaus directly near production
  • Partnership with Red Pitaya (Slovenien) for distribution and support of their boards and kits (Starter-Kit, Diagnostic-Kit)
  • Partnership with SoC-e (System-on-Chip engineering) for distribution and support of their SMARTZynq modules and carrier boards
  • Partnership with MYIR (Make Your Ideas Real) for distribution and support of their Zynq boards and kits
  • Partnership with Sundance (UK) for distribution and support of their carrier boards, which also can be implemented with our modules

2014

  • Trenz Electronic TE0715 series: Xilinx Zynq-7015/Zynq-7030 SoC, 1 GByte DDR SDRAM, 32 MByte Flash, Ethernet, 4 x Transceiver, 4 x 5 cm form factor
  • Trenz Electronic TE0741 series: Xilinx Kintex-7 FPGA, XC7K70T to XC7K410T, 32 MByte SPI Flash, 8 MGT's

2013

SoMs (system on modules) with 8 GBit DDR3 SDRAM, 4 GByte eMMC, 32 MByte SPI Flash, RTC, Gigabit Ethernet, and USB in a uniform 4 x 5 cm compact form factor:

  • Trenz Electronic TE0710 series: Xilinx Artix-7 FPGA, low-cost module with DDR3 SDRAM;
  • Trenz Electronic TE0711 series: Xilinx Artix-7 FPGA, optimized for high I/O count;
  • Trenz Electronic TE0720 series: Xilinx Zynq-7000 SoC, connecting a dual-core ARM Cortex-A9 CPU and a 28 nm FPGA in a single device;
  • Trenz Electronic TE0770 series: Xilinx Kintex-7 FPGA, offering much DSP power and four 12.5 GBit/s high-performance transceivers at the best price-performance ratio.
  • Trenz Electronic becomes Xilinx Alliance Partner - Certified Member.

2011

  • Trenz Electronic TE0630 series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (USB 2.0 configuration and data communication, 32-bit DDR SDRAM, SPI Flash, mechanically and largely electrically compatible with Trenz Electronic TE0300).
  • Partnership with TED (Tokyo Electron Device, Japan) for distribution and support of their high-end inrevium FPGA boards and kits.
  • Partnership with VeeaR (Austria) for distribution and support of their boards and kits for voice recognition and voice control.
  • Partnership with Eikon (Italy) for distribution and support of their boards and open source embedded platform OpenPicus for the internet of things.
  • Partnership with Epiq Solutions (USA) for distribution and support of their SDR (software defined radio) and CR (cognitive radio) boards and open source platforms.
  • Partnership with NGX Technology (India) for distribution and support of their MCU boards and kits.

2010

  • Partnership with Tokushu Denshi Kairo (Japan) for distribution and support of their Xilinx Spartan-6 FPGA modules with USB 2.0 (configuration, communication, JTAG).
  • Trenz Electronic GigaBee XC6SLX (TE0600) series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (gigabit Ethernet data communication, 32-bit DDR SDRAM, SPI Flash).
  • Partnership with PoLabs (Slovenia) for distribution and support of their USB interfaces modules.
  • Trenz Electronic becomes German branch and European agent of SytemBase (South Korea).
  • Partnership with GlobalTop Technology (Taiwan) for distribution and support of their GPS and RF products.
  • Development of a verification system based on Atmark Techno Suzaku.

2009

  • Partnership with Mirifica (Italy) for distribution and support of Trenz Electronic products in Italy.
  • Development of a PCIe backplane.
  • Trenz Electronic TE0320: Xilinx Spartan-3A DSP industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, 32-bit DDR SDRAM, SPI Flash).
  • Partnership with Digilent (USA) for distribution and support of its digital design products.

2008

  • Development of a PCIe board with 4 channel x 10-bit x 1.25 Gsps per channel ADC (maximum sampling rate of 5 Gsps) based on a Xilinx Virtex-5 FX30 FPGA.
  • Development of an interface between a power plant and an industrial computer.
  • Development of an FPGA-based control system for laser exposure of printing plates.
  • Trenz Electronic TE0300: Xilinx Spartan-3E industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, DDR SDRAM, SPI Flash).

2007

  • Trenz Electronic becomes Xilinx Alliance Partner.
  • Development of a pulse measurement system with fiber optic synchronization and 16-bit 125 Msps ADCs.
  • Partnership with SystemBase (South Korea) for the distribution and support of their Eddy series.
  • Partnership with Simple Solutions (Germany)

2006

  • Development of a fiber optic router with 14 serial fiber ports based on a Xilinx Virtex-4 FX60 FPGA.
  • Development of scanner electronics with 48 channel x 12 bit x 40 Msps per channel ADC based on a Xilinx Virtex-4 LX25 FPGA.

2005

  • Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include SDRAM.
  • Development of a memory card reader with USB interface.
  • Partnership with OHO-Elektronik (Germany) for the distribution and support of their DIL (dual in-line) FPGA and CPLD mini-modules.
  • Begin of distribution of standard Xilinx (USA) evaluation boards and kits.
  • Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include a 40 Msps 12-bit ADC.
  • Development of an evaluation board for a dual-core ARM ASIC.
  • Partnership with Trycom (Taiwan) for the distribution and support of their industrial serial converters.
  • Partnership with Atmark Techno (Japan) for the distribution and support of their Suzaku series, an FPGA module with CPU and Linux preloaded.

2004

  • Development of an X/Y automatic wiring machine.
  • Partnership with embeddedCL (Chile) for the distribution of ARMermelator development board (Atmel AT91M42800A ARM7TDMI microcontroller + Xilinx Spartan-IIE FPGA) that, although short-lived, gained widespread acceptance in the embedded community.
  • Trenz Electronic TE-XC3S (TE0140): Xilinx Spartan-3 FPGA micromodule (USB 2.0, EEPROM, platform Flash for in-system configuration)

2002

  • Trenz Electronic personal undertaking is converted to Trenz Electronic GmbH limited liability company.
  • Development of a control system for high vacuum plasma cleaning.
  • Development of a control system for concrete coloring.
  • Trenz Electronic TE-XC2SE (TE0126): Xilinx Spartan-IIE FPGA development system (featuring SRAM and Flash PROM, configurable through USB).

2001

  • Trenz Electronic TE-XC2S (TE0115): Xilinx Spartan-II FPGA development system (configurable with parallel cable, expandable by peripheral modules).
  • Development of a frame-grabber for infrared cameras.

2000

  • Development of different 19" level converter cards for industrial applications (24 V -> 5 V and 5V -> 24 V)
  • Partnership with Omron Electronics for distribution and support of their industrial automation products.

1992

Foundation of Trenz Electronic as an electronic engineering office (personal undertaking).

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