2016

  • Trenz Electronic's FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics, worldwide distribution.
  • Trenz Electronic TE0714 series: Artix-7, just 4 x 3 cm form factor, 16 MByte QSPI Flash, 4 x GTP, 2 x 100 pin B2B connectors
  • Trenz Electronic TE0745 series: Zynq, 1 GByte DDR3, 32 MByte Flash, 1GBit Ethernet PHY, USB 2.0 OTG
  • Trenz Electronic "UltraSOM+" TE0808 series: Zynq UltraScale+, DDR4, HyperRAM, Flash, 20 x Gigabit Transceiver
  • Trenz Electronic TE0841 series: Kintex UltraScale, KU35/KU40, DDR4, 8 x Transceiver

2015

  • Trenz Electronic TE0728 series: automotive Zynq-7020, 512 MByte DDR3 SDRAM, 16 MByte SPI Flash und 2 x 100 MBit Ethernet
  • Trenz Electronic TE0729 series: Zynq-7020, 512 MByte DDR3 SDRAM, 32 MByte Flash, 3 x Ethernet, RTC, 5 x 7 cm form factor
  • Trenz Electronic TE0782 series: Zynq-7045, Zynq 1000, 1 GByte DDR3 SDRAM, 32 MByte Flash, Ethernet, RTC, optional 2 x 8 MByte HyperRAM
  • Trenz Electronic TE0725 series: Artix-7, 15T bis 100T, 32 MByte Flash, 2 x 50 Pin mit 2,54 pitch, 87 I/O's
  • Trenz Electronic "ZynqBerry" TE0726 series: Zynq Z-7010, 512 MByte DD3L, 16 MByte Flash, 4 USB-Anschlüsse, Rasberry Pi Model 2 form factor
  • Trenz Electronic "ArduZynq" TE0723 series: Arduino compatible Zynq-Shield, Zynq Z-7010, 128/512 MByte DDR SDRAM, 16 MB Flash
  • Trenz Electronic TE0722 series: Zynq-7010, 16 MByte SPI Flash, DIP 40, Form Faktor 1,8 x 5,1 cm, 
  • SMD inhouse manufacturing
  • Enhancement of Production-, Office and Developer-Team, new bureaus directly near production
  • Partnership with Red Pitaya (Slovenien) for distribution and support of their boards and kits (Starter-Kit, Diagnostic-Kit)
  • Partnership with SoC-e (System-on-Chip engineering) for distribution and support of their SMARTZynq modules and carrier boards
  • Partnership with MYIR (Make Your Ideas Real) for distribution and support of their Zynq boards and kits
  • Partnership with Sundance (UK) for distribution and support of their carrier boards, which also can be implemented with our modules

2014

  • Trenz Electronic TE0715 series: Zynq-7015/Zynq-7030 SoC, 1 GByte DDR SDRAM, 32 MByte Flash, Ethernet, 4 x Transceiver
  • Trenz Electronic TE0741 series: Kintex-7 FPGA, XC7K70T to XC7K410T, 32 MByte SPI Flash, 8 MGT's

2013

SoMs (system on modules) with 8 GBit DDR3 SDRAM, 4 GByte eMMC, 32 MByte SPI Flash, RTC, Gigabit Ethernet, and USB in a uniform 4 x 5 cm compact format factor:

  • Trenz Electronic TE0710 series: Artix-7 FPGA, low-cost module with DDR3 SDRAM;
  • Trenz Electronic TE0711 series: Artix-7 FPGA, optimized for high I/O count;
  • Trenz Electronic TE0720 series: with Zynq-7000 SoC, connecting a dual-core ARM Cortex-A9 CPU and a 28 nm FPGA in a single device;
  • Trenz Electronic TE0770 series: Kintex-7 FPGA, offering much DSP power and four 12.5 GBit/s high-performance transceivers at the best price-performance ratio.
  • Trenz Electronic becomes Xilinx Alliance Partner - Certified Member.

2011

  • Trenz Electronic TE0630 series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (USB 2.0 configuration and data communication, 32-bit DDR SDRAM, SPI Flash, mechanically and largely electrically compatible with Trenz Electronic TE0300).
  • Partnership with TED (Tokyo Electron Device, Japan) for distribution and support of their high-end inrevium FPGA boards and kits.
  • Partnership with VeeaR (Austria) for distribution and support of their boards and kits for voice recognition and voice control.
  • Partnership with Eikon (Italy) for distribution and support of their boards and open source embedded platform OpenPicus for the internet of things.
  • Partnership with Epiq Solutions (USA) for distribution and support of their SDR (software defined radio) and CR (cognitive radio) boards and open source platforms.
  • Partnership with NGX Technology (India) for distribution and support of their MCU boards and kits.

2010

  • Partnership with Tokushu Denshi Kairo (Japan) for distribution and support of their Xilinx Spartan-6 FPGA modules with USB 2.0 (configuration, communication, JTAG).
  • Trenz Electronic GigaBee XC6SLX (TE0600) series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (gigabit Ethernet data communication, 32-bit DDR SDRAM, SPI Flash).
  • Partnership with PoLabs (Slovenia) for distribution and support of their USB interfaces modules.
  • Trenz Electronic becomes German branch and European agent of SytemBase (South Korea).
  • Partnership with GlobalTop Technology (Taiwan) for distribution and support of their GPS and RF products.
  • Development of a verification system based on Atmark Techno Suzaku.

2009

  • Partnership with Mirifica (Italy) for distribution and support of Trenz Electronic products in Italy.
  • Development of a PCIe backplane.
  • Trenz Electronic TE0320: Xilinx Spartan-3A DSP industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, 32-bit DDR SDRAM, SPI Flash).
  • Partnership with Digilent (USA) for distribution and support of its digital design products.

2008

  • Development of a PCIe board with 4 channel x 10-bit x 1.25 Gsps per channel ADC (maximum sampling rate of 5 Gsps) based on a Xilinx Virtex-5 FX30 FPGA.
  • Development of an interface between a power plant and an industrial computer.
  • Development of an FPGA-based control system for laser exposure of printing plates.
  • Trenz Electronic TE0300: Xilinx Spartan-3E industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, DDR SDRAM, SPI Flash).

2007

  • Trenz Electronic becomes Xilinx Alliance Partner.
  • Development of a pulse measurement system with fiber optic synchronization and 16-bit 125 Msps ADCs.
  • Partnership with SystemBase (South Korea) for the distribution and support of their Eddy series.
  • Partnership with Simple Solutions (Germany)

2006

  • Development of a fiber optic router with 14 serial fiber ports based on a Xilinx Virtex-4 FX60 FPGA.
  • Development of scanner electronics with 48 channel x 12 bit x 40 Msps per channel ADC based on a Xilinx Virtex-4 LX25 FPGA.

2005

  • Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include SDRAM.
  • Development of a memory card reader with USB interface.
  • Partnership with OHO-Elektronik (Germany) for the distribution and support of their DIL (dual in-line) FPGA and CPLD mini-modules.
  • Begin of distribution of standard Xilinx (USA) evaluation boards and kits.
  • Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include a 40 Msps 12-bit ADC.
  • Development of an evaluation board for a dual-core ARM ASIC.
  • Partnership with Trycom (Taiwan) for the distribution and support of their industrial serial converters.
  • Partnership with Atmark Techno (Japan) for the distribution and support of their Suzaku series, an FPGA module with CPU and Linux preloaded.

2004

  • Development of an X/Y automatic wiring machine.
  • Partnership with embeddedCL (Chile) for the distribution of ARMermelator development board (Atmel AT91M42800A ARM7TDMI microcontroller + Xilinx Spartan-IIE FPGA) that, although short-lived, gained widespread acceptance in the embedded community.
  • Trenz Electronic TE-XC3S (TE0140): Xilinx Spartan-3 FPGA micromodule (USB 2.0, EEPROM, platform Flash for in-system configuration)

2002

  • Trenz Electronic personal undertaking is converted to Trenz Electronic GmbH limited liability company.
  • Development of a control system for high vacuum plasma cleaning.
  • Development of a control system for concrete coloring.
  • Trenz Electronic TE-XC2SE (TE0126): Xilinx Spartan-IIE FPGA development system (featuring SRAM and Flash PROM, configurable through USB).

2001

  • Trenz Electronic TE-XC2S (TE0115): Xilinx Spartan-II FPGA development system (configurable with parallel cable, expandable by peripheral modules).
  • Development of a frame-grabber for infrared cameras.

2000

  • Development of different 19" level converter cards for industrial applications (24 V -> 5 V and 5V -> 24 V)
  • Partnership with Omron Electronics for distribution and support of their industrial automation products.

1992

Foundation of Trenz Electronic as an electronic engineering office (personal undertaking).

2016 Trenz Electronic's FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics , worldwide distribution. Trenz Electronic TE0714 series: Artix-7, just 4... read more »
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2016

  • Trenz Electronic's FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics, worldwide distribution.
  • Trenz Electronic TE0714 series: Artix-7, just 4 x 3 cm form factor, 16 MByte QSPI Flash, 4 x GTP, 2 x 100 pin B2B connectors
  • Trenz Electronic TE0745 series: Zynq, 1 GByte DDR3, 32 MByte Flash, 1GBit Ethernet PHY, USB 2.0 OTG
  • Trenz Electronic "UltraSOM+" TE0808 series: Zynq UltraScale+, DDR4, HyperRAM, Flash, 20 x Gigabit Transceiver
  • Trenz Electronic TE0841 series: Kintex UltraScale, KU35/KU40, DDR4, 8 x Transceiver

2015

  • Trenz Electronic TE0728 series: automotive Zynq-7020, 512 MByte DDR3 SDRAM, 16 MByte SPI Flash und 2 x 100 MBit Ethernet
  • Trenz Electronic TE0729 series: Zynq-7020, 512 MByte DDR3 SDRAM, 32 MByte Flash, 3 x Ethernet, RTC, 5 x 7 cm form factor
  • Trenz Electronic TE0782 series: Zynq-7045, Zynq 1000, 1 GByte DDR3 SDRAM, 32 MByte Flash, Ethernet, RTC, optional 2 x 8 MByte HyperRAM
  • Trenz Electronic TE0725 series: Artix-7, 15T bis 100T, 32 MByte Flash, 2 x 50 Pin mit 2,54 pitch, 87 I/O's
  • Trenz Electronic "ZynqBerry" TE0726 series: Zynq Z-7010, 512 MByte DD3L, 16 MByte Flash, 4 USB-Anschlüsse, Rasberry Pi Model 2 form factor
  • Trenz Electronic "ArduZynq" TE0723 series: Arduino compatible Zynq-Shield, Zynq Z-7010, 128/512 MByte DDR SDRAM, 16 MB Flash
  • Trenz Electronic TE0722 series: Zynq-7010, 16 MByte SPI Flash, DIP 40, Form Faktor 1,8 x 5,1 cm, 
  • SMD inhouse manufacturing
  • Enhancement of Production-, Office and Developer-Team, new bureaus directly near production
  • Partnership with Red Pitaya (Slovenien) for distribution and support of their boards and kits (Starter-Kit, Diagnostic-Kit)
  • Partnership with SoC-e (System-on-Chip engineering) for distribution and support of their SMARTZynq modules and carrier boards
  • Partnership with MYIR (Make Your Ideas Real) for distribution and support of their Zynq boards and kits
  • Partnership with Sundance (UK) for distribution and support of their carrier boards, which also can be implemented with our modules

2014

  • Trenz Electronic TE0715 series: Zynq-7015/Zynq-7030 SoC, 1 GByte DDR SDRAM, 32 MByte Flash, Ethernet, 4 x Transceiver
  • Trenz Electronic TE0741 series: Kintex-7 FPGA, XC7K70T to XC7K410T, 32 MByte SPI Flash, 8 MGT's

2013

SoMs (system on modules) with 8 GBit DDR3 SDRAM, 4 GByte eMMC, 32 MByte SPI Flash, RTC, Gigabit Ethernet, and USB in a uniform 4 x 5 cm compact format factor:

  • Trenz Electronic TE0710 series: Artix-7 FPGA, low-cost module with DDR3 SDRAM;
  • Trenz Electronic TE0711 series: Artix-7 FPGA, optimized for high I/O count;
  • Trenz Electronic TE0720 series: with Zynq-7000 SoC, connecting a dual-core ARM Cortex-A9 CPU and a 28 nm FPGA in a single device;
  • Trenz Electronic TE0770 series: Kintex-7 FPGA, offering much DSP power and four 12.5 GBit/s high-performance transceivers at the best price-performance ratio.
  • Trenz Electronic becomes Xilinx Alliance Partner - Certified Member.

2011

  • Trenz Electronic TE0630 series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (USB 2.0 configuration and data communication, 32-bit DDR SDRAM, SPI Flash, mechanically and largely electrically compatible with Trenz Electronic TE0300).
  • Partnership with TED (Tokyo Electron Device, Japan) for distribution and support of their high-end inrevium FPGA boards and kits.
  • Partnership with VeeaR (Austria) for distribution and support of their boards and kits for voice recognition and voice control.
  • Partnership with Eikon (Italy) for distribution and support of their boards and open source embedded platform OpenPicus for the internet of things.
  • Partnership with Epiq Solutions (USA) for distribution and support of their SDR (software defined radio) and CR (cognitive radio) boards and open source platforms.
  • Partnership with NGX Technology (India) for distribution and support of their MCU boards and kits.

2010

  • Partnership with Tokushu Denshi Kairo (Japan) for distribution and support of their Xilinx Spartan-6 FPGA modules with USB 2.0 (configuration, communication, JTAG).
  • Trenz Electronic GigaBee XC6SLX (TE0600) series: industrial-grade Xilinx Spartan-6 LX FPGA micro-module (gigabit Ethernet data communication, 32-bit DDR SDRAM, SPI Flash).
  • Partnership with PoLabs (Slovenia) for distribution and support of their USB interfaces modules.
  • Trenz Electronic becomes German branch and European agent of SytemBase (South Korea).
  • Partnership with GlobalTop Technology (Taiwan) for distribution and support of their GPS and RF products.
  • Development of a verification system based on Atmark Techno Suzaku.

2009

  • Partnership with Mirifica (Italy) for distribution and support of Trenz Electronic products in Italy.
  • Development of a PCIe backplane.
  • Trenz Electronic TE0320: Xilinx Spartan-3A DSP industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, 32-bit DDR SDRAM, SPI Flash).
  • Partnership with Digilent (USA) for distribution and support of its digital design products.

2008

  • Development of a PCIe board with 4 channel x 10-bit x 1.25 Gsps per channel ADC (maximum sampling rate of 5 Gsps) based on a Xilinx Virtex-5 FX30 FPGA.
  • Development of an interface between a power plant and an industrial computer.
  • Development of an FPGA-based control system for laser exposure of printing plates.
  • Trenz Electronic TE0300: Xilinx Spartan-3E industrial-grade FPGA micro-module (USB 2.0 for configuration and data communication, DDR SDRAM, SPI Flash).

2007

  • Trenz Electronic becomes Xilinx Alliance Partner.
  • Development of a pulse measurement system with fiber optic synchronization and 16-bit 125 Msps ADCs.
  • Partnership with SystemBase (South Korea) for the distribution and support of their Eddy series.
  • Partnership with Simple Solutions (Germany)

2006

  • Development of a fiber optic router with 14 serial fiber ports based on a Xilinx Virtex-4 FX60 FPGA.
  • Development of scanner electronics with 48 channel x 12 bit x 40 Msps per channel ADC based on a Xilinx Virtex-4 LX25 FPGA.

2005

  • Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include SDRAM.
  • Development of a memory card reader with USB interface.
  • Partnership with OHO-Elektronik (Germany) for the distribution and support of their DIL (dual in-line) FPGA and CPLD mini-modules.
  • Begin of distribution of standard Xilinx (USA) evaluation boards and kits.
  • Custom modification of Trenz Electronic TE-XC3S FPGA (TE0140) micro-module to include a 40 Msps 12-bit ADC.
  • Development of an evaluation board for a dual-core ARM ASIC.
  • Partnership with Trycom (Taiwan) for the distribution and support of their industrial serial converters.
  • Partnership with Atmark Techno (Japan) for the distribution and support of their Suzaku series, an FPGA module with CPU and Linux preloaded.

2004

  • Development of an X/Y automatic wiring machine.
  • Partnership with embeddedCL (Chile) for the distribution of ARMermelator development board (Atmel AT91M42800A ARM7TDMI microcontroller + Xilinx Spartan-IIE FPGA) that, although short-lived, gained widespread acceptance in the embedded community.
  • Trenz Electronic TE-XC3S (TE0140): Xilinx Spartan-3 FPGA micromodule (USB 2.0, EEPROM, platform Flash for in-system configuration)

2002

  • Trenz Electronic personal undertaking is converted to Trenz Electronic GmbH limited liability company.
  • Development of a control system for high vacuum plasma cleaning.
  • Development of a control system for concrete coloring.
  • Trenz Electronic TE-XC2SE (TE0126): Xilinx Spartan-IIE FPGA development system (featuring SRAM and Flash PROM, configurable through USB).

2001

  • Trenz Electronic TE-XC2S (TE0115): Xilinx Spartan-II FPGA development system (configurable with parallel cable, expandable by peripheral modules).
  • Development of a frame-grabber for infrared cameras.

2000

  • Development of different 19" level converter cards for industrial applications (24 V -> 5 V and 5V -> 24 V)
  • Partnership with Omron Electronics for distribution and support of their industrial automation products.

1992

Foundation of Trenz Electronic as an electronic engineering office (personal undertaking).