Embedded world 23 will start soon and Trenz Electronic will present the latest product to the world public.
The Trenz Electronic TE0950-01-EGBE11A is a powerful adaptive SoC evaluation board, equipped with an AMD Versal™ AI Edge VE2302 device (engineering sample). Furthermore, the board is equipped with 4 GByte DDR4 SDRAM and 128 MByte SPI Flash for configuration and data storage as well as powerful switching power supplies for all required voltages. A large number of inputs and outputs are provided by robust, flexible and cost-effective high-speed connectors.
All parts are at least commercial temperature range of 0°C to +70°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Key Features
- SoC
- AMD Versal™ AI Edge XCVE2302-1LSESFVA784 device (engineering sample)
- A784 package (pin compatible VE2002, VE2102, VE2202, VE2302, VM1102)
- AMD Versal™ AI Edge XCVE2302-1LSESFVA784 device (engineering sample)
- RAM/Storage
- 4 GByte DDR4 SDRAM
- 128 MByte SPI Flash (primary boot option)
- MicroSD card (primary boot option)
- 32 GByte e.MMC (secondary boot option)
- EEPROM with MAC-address
- On Board
- AMD Artix™ 7 FPGA as configurable Levelshifter/MUX for FMC and other 3.3 V IOs
- 32 MByte SPI Flash
- 1 dip switch
- 2 LEDs
- USB 2.0 Host/Device/OTG (type Micro A/B connector)
- USB JTAG + UART Micro-USB B
- Gigabit Ethernet RJ45
- Output
- 2 LEDs (1 x MIO, 1 x PL)
- Input
- 1 push button
- 3 dip switches (2 x MIO, 1 x PL)
- Reset button
- AMD Artix™ 7 FPGA as configurable Levelshifter/MUX for FMC and other 3.3 V IOs
- Interface
- zQSFP with 4 GTYP Transceiver
- 2 x CRUVI HS (each optimized for 4 Lane MIPI, one with reduced pinout)
- 2 x CRUVI LS
- CSI-2 connector (camera, 2 lane MIPI)
- FMC
- 4 GTYP Transceiver
- 34 LA diff pairs to Levelshifter/MUX
- Power
- 12 V plug
- 12 V plug
- Dimension
- 150 mm x 120 mm
- 150 mm x 120 mm
Other assembly options for cost or performance optimization plus high volume prices available on request.