Heat Sink including fan for Trenz Electronic TEB0911 and TEF1001 Series
Active cooling solution made of aluminium with thermal pad and fan, dimension heat sink: 60 x 58 x 33 mm
Article number:
25130
Stock:
3
TEB0911 UltraRack+ MPSoC Board with AMD Zynq™ UltraScale+™ ZU9,6 FMC Connectors
MPSoC Board with AMD Zynq™ UltraScale+™ XCZU9EG-1FFVB1156E, 8 GByte 64-Bit DDR4 SO-DIMM (PS connected), M2 PCIe SSD (1-Lane), eMMC (bootable), Dual QSPI Flash (bootable)
Article number:
TEB0911-05-9BEX1MA
Stock:
1