Trenz Electronic FPGA and SoC Modules
The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.
Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.
Other assembly options for cost or performance optimization plus high volume prices available on request.
Trenz Electronic will not discontinue series as long as key components are available.
Through
our membership in the AMD ACP Program, we learn as
early as possible about upcoming discontinuations and prepare
transitions to possible successors to ideally ensure a seamless
transition.
Life cycles of Trenz Electronic modules and carrier boards.
Carrier boards are no longer produced as soon as all modules that fit on them go EOL.
Produkts with integrated AMD FPGA
| Series | Device Family | Carrierboard | Year of launch | Expected EOL (life cycle in years) |
| TE09xx | Versal™ AI Edge | 2024 | 2045+ (21+) | |
| TE08xx | Zynq™ UltraScale+™ Kintex™ UltraScale™ | TEBA08xx, TEBF08xx, TEBT08xx | 2017 | 2045 (28) |
| TE07xx | Zynq™ 7000 Artix™ 7 Kintex™ 7 | TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x | 2012 | 2040 (28) |
| TE0630 | Spartan™ 6 USB | TE0303 | 2011 | 2030 (19) |
| TE0600 | Spartan™ 6 Ethernet | TE0603 | 2010 | 2030 (20) |
Produkts with integrierated Altera® FPGA
| Series | Device Family | Carrierboard | Year of launch | Expected EOL (life cycle in years) |
| TEI0180 | Agilex™ | - | 2019 | 2035 (16) |
| TEI0003 | Cyclone® 10 | - | 2017 | 2040 (23) |
| TEI0006 |
Cyclone® 10 | TEIB0006 | 2017 | 2040 (23) |
| TEI0009 |
Cyclone® 10 | - | 2017 | 2040 (23) |
| TEI1000 | Stratix® 10 | TEB1000 | 2016 | 2035 (19) |
| TEI0001 | Max® 10 | - | 2014 | 2040 (26) |
| TEI0010 | Max® 10 | - | 2014 | 2040 (26) |
