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Products
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Trenz Electronic
- Coming Soon
- Andromeda
- RFSoC
- Carrier Boards
- 4 x 5 SoMs
- Starter Kits
- Development Boards
- Motherboards und Carrier
- CRUVI
- FMC Cards
- PCIe FMC Carrier
- Pmod-Compatible
- Cooling Solutions
- Modules & Heat Spreader
- Open Hardware
- Altera® SoM
- TE09XX - Versal™
- TE0890 - Spartan™ 7
- TE08XX - Zynq™ UltraScale+™
- TE0841 - Kintex™ UltraScale™
- TE07XX - Zynq™ SoC
- TE0741 - Kintex™ 7
- TE07XX - Artix™ 7
- TE0630 - Spartan™ 6 USB
- TE0600 - Spartan™ 6 Ethernet
- SMF2000 - Microchip SF2
- TEM0005 - Microchip SF2
- TEM0007 - Microchip PolarFire®
- TEM0010 - Microchip PIC64GX
- LXO2000 - Lattice XO2-4000
- Digilent
- Missing Link Electronics
- GOWIN Semiconductor
- MEGA65
- OnSite Broadcast
- Sundance
- Programmable Logic
- Measurement and Test
- icoBoards
- JTAG & Accessories
- Robotics / Mechatronics
- SFP
- Power Supply
- Cooling Solutions
- Accessories
- Components
Trenz Electronic FPGA and SoC Modules
The micromodules designed by Trenz Electronic feature modern FPGA's. With small size and high-density connectors, they can be used nearly everywhere.
Gigabit Ethernet and integrated USB guarantees high data transfer rates to a host PC.
Other assembly options for cost or performance optimization plus high volume prices available on request.
Trenz Electronic will not discontinue series as long as key components are available.
Through
our membership in the AMD ACP Program, we learn as
early as possible about upcoming discontinuations and prepare
transitions to possible successors to ideally ensure a seamless
transition.
Life cycles of Trenz Electronic modules and carrier boards.
Carrier boards are no longer produced as soon as all modules that fit on them go EOL.
Products with integrated AMD FPGA
| Series | Device Family | Carrierboard | Year of launch | Expected EOL (life cycle in years) |
| TE09xx | Versal™ AI Edge | 2024 | 2045+ (21+) | |
| TE08xx | Zynq™ UltraScale+™ Kintex™ UltraScale™ | TEBA08xx, TEBF08xx, TEBT08xx | 2017 | 2045 (28) |
| TE07xx | Zynq™ 7000 Artix™ 7 Kintex™ 7 | TEBA07xx, TEBB07xx, TEB07xx, TEBT07xx, TE070x | 2012 | 2040 (28) |
| TE0630 | Spartan™ 6 USB | TE0303 | 2011 | 2030 (19) |
| TE0600 | Spartan™ 6 Ethernet | TE0603 | 2010 | 2030 (20) |
Products with integrated Altera® FPGA
| Series | Device Family | Carrierboard | Year of launch | Expected EOL (life cycle in years) |
| TEI0180 | Agilex™ | - | 2019 | 2035 (16) |
| TEI0003 | Cyclone® 10 | - | 2017 | 2040 (23) |
| TEI0006 |
Cyclone® 10 | TEIB0006 | 2017 | 2040 (23) |
| TEI0009 |
Cyclone® 10 | - | 2017 | 2040 (23) |
| TEI1000 | Stratix® 10 | TEB1000 | 2016 | 2035 (19) |
| TEI0001 | Max® 10 | - | 2014 | 2040 (26) |
| TEI0010 | Max® 10 | - | 2014 | 2040 (26) |
Key Features Supported SoM Trenz Electronic high-performance MPSoC module TE0865 with an AMD Zynq™ UltraScale+™ B2B Connectors 4x B2B Samtec ADF6-60-03.5-L-4-2-FR IO resources: 1x stacked zQSFP+ (2x zQSFP+) 2x stacked SFP+ (4x SFP+) Display Port TX 2 Lanes 1x RJ45 stacked with 2x USB3.0 Type A 1x Push-Push microSD 2x FMC+ (16x DP + 18x LA) 1x FMC (8x DP + 34x LA) M.2 SSD Socket Connector Key M PCIe 2x LS CRUVI 1x HS CRUVI 2x GT CRUVI MIPI CSI-2 4 Lanes (22 pins connector) JTAG via USB Type C (FTDI FT2232H) 1x Samtec FireFly (4 Lanes) 1x USB Type E (Assembly option) Clock source: 2x PLL SI5338A-B-GMR ON-Board peripherals 1x 128K EEPROM 24LC128-I/ST 2x 8K EEPROM M93C66-RMC6TG 2x 512K EEPROM CAT24C512WI-GT3 5x DIP Switches 7x Push Buttons 27x Green LEDs + 4x Red Leds System controller: Altera MAX 10 FPGA 10M08SAU169I7G Dimension 231 x 213 mm Power 12V Input Supply Voltage