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TEB0911 UltraRack+ MPSoC Board with AMD Zynq™ UltraScale+™ ZU9,6 FMC Connectors

Product information "TEB0911 UltraRack+ MPSoC Board with AMD Zynq™ UltraScale+™ ZU9,6 FMC Connectors"

The predecessor of this article is TEB0911-04-9BEX1MA. All changes are in the Product Change Notification (PCN).

The Trenz Electronic TEB0911 UltraRack+ board is integrating a AMD Zynq™ UltraScale+™ ZU9EG MPSoC with 2 x 64 MByte Flash memory for configuration and operation, 8 GByte DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq™ UltraScale+™ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Zynq™ UltraScale+™ MPSoC XCZU9EG-1FFVB1156E
    • 1156 Pin Package
  • 8 GByte 64-Bit DDR4 SO-DIMM (PS connected)
  • Active heat sink (serial number 638088 and above)
  • M2 PCIe SSD (1-Lane)
  • 8 GByte e.MMC (bootable)
  • 2 x 64 MByte Dual QSPI Flash (bootable)
  • System Controller(LCMXO2-7000HC)
    • Power Sequencing
    • IO Expander
  • Configurable PLLs
  • GTH/GTP Reference CLKs

Front Panel

  • 4 x FMC
    • 4 GTH per FMC
    • 68 ZynqMP PL IO per FMC
  • DisplayPort (2-Lanes)
  • RJ34 ETH + Dual USB3 Combo
  • Dual Stack SFP+
  • SD (bootable)
  • Status LEDs

Back Panel

  • 2 x FMC
    • 4/2 GTH
    • 12 ZynqMP PL IO per FMC
  • 56 SC IO per FMC
  • USB JTAG/UART ZynqMP
  • USB JTAG/GPIO FMC
  • CAN FD (DB9 Connector)
  • SMA (external CLK)
  • 5-pin 24 V power connector

Board size

  • 406 mm × 234.30 mm, please download the assembly diagram for exact details

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Enterprise Edition (paid version)

The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.

Overview Vivado Standard and Enterprise Edition

Development Support

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TEB0911-05-9BEX1MA Trenz Electronic UltraRack+ MPSoC board with AMD Zynq™ UltraScale+™ ZU9EG
  • 1 x active heat sink, pre-assembled

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

The online pictures of this product are not a legally binding offer, but are symbol pictures for illustration and presentation only.

Properties "TEB0911 UltraRack+ MPSoC Board with AMD Zynq™ UltraScale+™ ZU9,6 FMC Connectors"
Properties
FPGA Manufacturer: AMD
FPGA/SoC Architecture: UltraScale+
FPGA/SoC Family: Zynq
FPGA/SoC Type: MPSoC
Data according to manufacturer. Errors and changes reserved.

Downloads

Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference
Files SBSE____.ZZC
Size 4 B / Modified 29.09.2026 - 16:31:35

TEB0911 UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ and 6 FMC connectors

  • Shop TEB0911 - contains prices, available stock, disposability, scope of delivery and more
  • Download area - various reference designs, schematics, hardware designs and more
  • Pinout/Tracelength Table - illustration of pinout, tracelength and cross reference Information of modules with different baseboards
  • TE0790 Resources - XMOD JTAG Programmer documentation

Support

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Accessories

Heat Sink including fan for Trenz Electronic TEB0911 and TEF1001 Series
Heat Sink including fan for Trenz Electronic TEB0911 and TEF1001 Series
Active cooling solution made of aluminium with thermal pad and fan, dimension heat sink: 60 x 58 x 33 mm
Article number: 25130
Stock: 0

Regular price: US$49.98