Baseboard for TE0724
Development carrier board for the TE0724 SoC module and compatible modules.
Article number:
TEB0724-02
Stock:
60
BGA Heat Sink for Trenz Electronic Module TE0724-04, 17 x 17 x 17.5 mm
High Performance maxiFLOW/superGRIP Heat Sink BGA Aluminum, Top Mount
Article number:
30829
Stock:
0
SoC Module with AMD Zynq™ 7010-1I, 1 GByte DDR3L, 64 MByte Flash, 4 x 6 cm
AMD Zynq™ XC7Z010-1CLG400I, Dual-core ARM Cortex-A9, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash, 1 Gbit Ethernet PHY, size: 4 x 6 cm
Article number:
TE0724-04-41I33-A
Stock:
0
SoC Module with AMD Zynq™ 7020-1I, 1 GByte DDR3L, 64 MByte Flash, 4 x 6 cm
AMD Zynq™ XC7Z020-1CLG400I, Dual-core ARM Cortex-A9, 1 GByte DDR3L SDRAM, 64 MByte QSPI Flash, 1 Gbit Ethernet PHY, size: 4 x 6 cm
Article number:
TE0724-04-61I33-A
Stock:
0