The Trenz Electronic TE0812 is a powerful (space grade) module integrating a Xilinx Zynq UltraScale+ MPSoC with 4 GByte DDR4 SDRAM ECC, dual 64/128 MByte serial Flash memory for configuration and operation, dual 4 Mbit MRAM, 2 x 32 GByte e.MMC, and powerful switch-mode power supplies for all on-board voltages.
Extended-grade module based on Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. The system controller CPLD is provided by Lattice MachXO2.
New product release: ZynqBerryZero - Module with Xilinx Zynq-7010 in a Raspberry Pi Zero Form Factor
The 3 x 6.5 cm small ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero.
This is a limited run aimed at developers who want to participate and start producing software for the final machines, which are expected to be released in 2021.
The evaluation board for the XC7Z015 All Programmable SoC (AP SoC) provides a hardware environment for developing and evaluating designs targeting the Zynq-7000 XC7Z015 -1FFG485C All Programmable SoC.
The Trenz Electronic TE0802 is a development board integrating a Xilinx Zynq UltraScale+. Other assembly options for the FPGA and the memory chips are available.
New product release: TE0821 - MPSoC Module with Xilinx Zynq UltraScale+ ZU3EG-1, 2 GByte DDR4 SDRAM, 4 x 5 cm
The Trenz Electronic TE0821-01-3BE21FA is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG.
The Trenz Electronic TE0890-01-25-1C is a FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM (may be used as video frame buffer), 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os.
Trenz Electronic launches UltraSoM+ system-on-module based on the ground-breaking Xilinx Zynq UltraScale+ MPSoC
Targets complex multi-tasking embedded system designs in automotive, broadcast, communications, industrial, medical, mil/aero, and test & measurement markets