Heat Sink SuperGrip for Trenz Electronic MPSoC Modules TE0803 and TE0813
US$41.65
Possible to order, delivery time on request.
Article number:
29665
Stock:
0
| Quantity | Unit price |
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| To 9 |
US$41.65
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| From 10 |
US$37.49
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| From 25 |
US$37.49
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| From 50 |
US$33.32
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| From 100 |
US$31.24
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| From 250 |
US$31.24
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| From 500 |
US$27.91
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| From 1000 |
US$27.91
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Product information "Heat Sink SuperGrip for Trenz Electronic MPSoC Modules TE0803 and TE0813"
BGA Heat Sink - High Performance maxiFLOW/superGRIP - Low Profile
Heat Sink Type: maxiFLOW
Heat Sink Attachment: superGRIP
Features
- Designed for 23 x 23 mm components
- Requires minimal space around the component’s perimeter; ideal for densely populated PCBs
- Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked
- Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs
- Eliminates the need to drill mounting holes in the PCB
Product Detail
https://www.qats.com/images/products/Schematic/maxiFLOW-superGRIP.jpg
Dimension A: 23.00 mm
Dimension B: 23.00 mm
Dimension C: 7.50 mm
Dimension D: 37.5 mm
TIM: T766
Finish: Blue-Anodized
- Dimension A and B refer to component size
- Dimension C is the heat sink height from the bottom of the base to the top of the fin field
- Thermal performance data are provided for reference only. Actual performance may vary by application
- ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant
Scope of Delivery
- 1 x 29665 - Heat Sink SuperGrip
Additional Information
- Manufacturer: ATS Advanced Thermal Solutions, Inc.
- Manufacturer's article number: ATS Part#: ATS-X50230B-C1-R0
- More information
Properties "Heat Sink SuperGrip for Trenz Electronic MPSoC Modules TE0803 and TE0813"
Properties
| Compatible with: | TE0803, TE0813 |
|---|
Data according to manufacturer. Errors and changes reserved.