The Trenz Electronic TE0802 is a development board integrating a Xilinx Zynq UltraScale+. Other assembly options for the FPGA and the memory chips are available.
The Trenz Electronic TE0821-01-3BE21FA is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG.
Industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver, and I/O performance than the previous generation of low cost FPGAs.
The VCS-1 is a PC/104 Linux stack composed of 2 main components, namely the EMC2 board which is a PCIe/104 OneBank™ carrier for a Trenz compatible SoC Module and the FM191 expansion card that fans out the I/Os from the SoC to the outside world.
The Module has 256 MByte DDR3L SDRAM, a Gigabit Ethernet PHY, four connection options for Pmods, a GPIO Pin header compatible to the Raspberry Pi pinout and a Micro USB to UART interface.
The TEB0724 is a developement carrier board for the Trenz Electronic's TE0724 and compatible modules. It facilitates easy access to all on the module available features.
The Cyclone10 LP Reference Kit is the worldwide first development board with a 55kLE Intel Cyclone 10 LP and a huge variety of interfaces for many applications. The board is fully qualified and ready to use for end products and can also be ordered in customized variants exactly according your requirements.
The Trenz Electronic TE0890-01-25-1C is a FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM (may be used as video frame buffer), 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os.
Benefit from the FPGA knowledge of our 70 top-class international speakers in a total of 10 main topics with over 100 technical presentations and hands-on tutorials including test development on boards and computers.
The TEC0117 is a low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard.
The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems
You will find us in Hall 3A, Stand 3A-240. We are looking forward to your visit!
Accelerate real-time high deﬁnition video processing applications with the Digilent Zybo Z7, a Zynq-7000 AP SoC Platform and Xilinx Vivado HLS
The FPGA Congress will take place from 12 - 14 June 2018 at the NH Hotel München-Dornach. Benefit from the FPGA knowledge of our 50 top-class international speakers in a total of 10 main topics with over 100 technical presentations and hands-on tutorials including test development on boards and computers.
The EDDP Kit enables rapid, simplified development and evaluation of three-phase motor control applications by providing software, documentation, binary images, editable source code to run on a Xilinx Zynq®-7000 All Programmable SoC along with associated hardware.
The Digilent Design Contest is an international student hardware design competition open to all students who are passionate about electronics, digital design and electrical engineering in general.
Win one of ten MAX1000!
places EMC2 hardware demonstration platform into the public domain
The competition aims to encourage creativity, originality and common sense to students, their mobilization in the implementation of projects of high complexity.
Global distributor Arrow Electronics is making available a FPGA IoT Maker Board. Designed for end-to-end application development and optimised for cost, the MAX1000 board can be installed directly into a custom application or integrated on to a separate board
New FMC board with L-Band RF input
Like last year you will find us in Hall 1, Booth 1-208. Our Co-Exhibitor Digilent Inc. and we are looking forward to your visit!
A lot of articles from Digilent are reduced now.
Trenz Electronic's FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics, a global electronic components distributor, as part of a new global distribution agreement signed by the two companies.