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Here you will find news, press releases and latest announcements.

The Trenz Electronic TE0812 is a powerful (space grade) module integrating a Xilinx Zynq UltraScale+ MPSoC with 4 GByte DDR4 SDRAM ECC, dual 64/128 MByte serial Flash memory for configuration and operation, dual 4 Mbit MRAM, 2 x 32 GByte e.MMC, and powerful switch-mode power supplies for all on-board voltages.
The 21st century realization of the Commodore™ 65 heritage: a complete 8-bit computer running more than 40x faster than a C64 while being increasingly compatible.
The TE0865 is a powerful MPSoC module with integrated Xilinx Zynq UltraScale+ ZU11-ZU19, 4 GB DDR4 SDRAM with ECC on PS and 4 GB DDR4 SDRAM on PL, 256 MB QSPI Boot Flash, Graphic Processing Unit (GPU), 1 x Gbit Ethernet transceiver PHY, USB2.0, system controller Intel MAX 10, extended temperature range, form factor 7.5 x 10 cm.
CRUVI modules with and without CO2 sensor, CRUVI adapter, motor control development kits with CRUVI module, CRUVI motor control module, carrier for CRUVI extension boards
Extended-grade module based on Xilinx Zynq UltraScale+ RFSoC. The module is equipped with 4 x 1 GByte DDR4 SDRAM memory, 2 x 64 MByte SPI Flash memory, USB2.0, Ethernet transceiver and 2 x Samtec Razor Beam Board to Board (B2B) connectors. The system controller CPLD is provided by Lattice MachXO2.
Commercial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC XC7Z020, with 1 GByte of DDR3L-1600 SDRAM, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages. A large number of configurable I/Os are provided via rugged high-speed board-to-board connectors.
The Trenz Electronic TEC0810 is a CompactPCI Serial Card (3U form factor) that can be used as a base for Trenz Electronic modules with a form factor of 5.2 x 7.6 cm. For configuration and service, JTAG and UART are available via USB bridge and 1 Gigabit Ethernet on the front panel. 48 differential signals are available on the backplane.
The 3 x 6.5 cm small ZynqBerryZero is a SoC module with integrated Xilinx Zynq-7010 FPGA and the form factor of the Raspberry Pi Zero.
This is a limited run aimed at developers who want to participate and start producing software for the final machines, which are expected to be released in 2021.
FMC module with Xilinx Artix-7 FPGA and 4 x 16-Bit GMSL serializers.
The Trenz Electronic TEF1002-02 carrier is a baseboard for Trenz Electronic 4 x 5 cm SoMs. It is a PCIe x1 card providing a FMC LPC connector.
The evaluation board for the XC7Z015 All Programmable SoC (AP SoC) provides a hardware environment for developing and evaluating designs targeting the Zynq-7000 XC7Z015 -1FFG485C All Programmable SoC.
Low cost small-sized FPGA module integrating a Microsemi SmartFusion2 FPGA SoC and 32 MByte QSPI Flash memory
The Trenz Electronic TE0802 is a development board integrating a Xilinx Zynq UltraScale+. Other assembly options for the FPGA and the memory chips are available.
The Trenz Electronic TE0821-01-3BE21FA is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ ZU3EG.
Industrial grade module based on Intel Cyclone 10 GX. Intel Cyclone 10 GX device family delivers higher core, transceiver, and I/O performance than the previous generation of low cost FPGAs.
The VCS-1 is a PC/104 Linux stack composed of 2 main components, namely the EMC2 board which is a PCIe/104 OneBank™ carrier for a Trenz compatible SoC Module and the FM191 expansion card that fans out the I/Os from the SoC to the outside world.
The Module has 256 MByte DDR3L SDRAM, a Gigabit Ethernet PHY, four connection options for Pmods, a GPIO Pin header compatible to the Raspberry Pi pinout and a Micro USB to UART interface.

New product release: Baseboard for TE0724

The TEB0724 is a developement carrier board for the Trenz Electronic's TE0724 and compatible modules. It facilitates easy access to all on the module available features.

New product release: Cyclone 10LP RefKit

The Cyclone10 LP Reference Kit is the worldwide first development board with a 55kLE Intel Cyclone 10 LP and a huge variety of interfaces for many applications. The board is fully qualified and ready to use for end products and can also be ordered in customized variants exactly according your requirements.
The Trenz Electronic TE0890-01-25-1C is a FPGA module integrating a Xilinx Spartan-7, 64 MBit HyperRAM DRAM (may be used as video frame buffer), 64 MBit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os.
Benefit from the FPGA knowledge of our 70 top-class international speakers in a total of 10 main topics with over 100 technical presentations and hands-on tutorials including test development on boards and computers.
The TEC0117 is a low cost FPGA module integrating a GOWIN LittleBee 1NR9 FPGA with 8 MByte internal SDRAM and 8 MByte SPI Flash for user applications. It's compatible to the Arduino MKR standard.
The DesignWare® ARC® EM Software Development Platform is a flexible platform for rapid software development on ARC EM processors and subsystems

Trenz Electronic GmbH at Embedded World 2019

You will find us in Hall 3A, Stand 3A-240. We are looking forward to your visit!
Accelerate real-time high definition video processing applications with the Digilent Zybo Z7, a Zynq-7000 AP SoC Platform and Xilinx Vivado HLS
The FPGA Congress will take place from 12 - 14 June 2018 at the NH Hotel München-Dornach. Benefit from the FPGA knowledge of our 50 top-class international speakers in a total of 10 main topics with over 100 technical presentations and hands-on tutorials including test development on boards and computers.
The EDDP Kit enables rapid, simplified development and evaluation of three-phase motor control applications by providing software, documentation, binary images, editable source code to run on a Xilinx Zynq®-7000 All Programmable SoC along with associated hardware.
The Digilent Design Contest is an international student hardware design competition open to all students who are passionate about electronics, digital design and electrical engineering in general.
places EMC2 hardware demonstration platform into the public domain

Digilent Design Contest

The competition aims to encourage creativity, originality and common sense to students, their mobilization in the implementation of projects of high complexity.

Arrow Electronics unveils FPGA IoT Maker Board

Global distributor Arrow Electronics is making available a FPGA IoT Maker Board. Designed for end-to-end application development and optimised for cost, the MAX1000 board can be installed directly into a custom application or integrated on to a separate board
New FMC board with L-Band RF input

Trenz Electronic GmbH at Embedded World 2017

Like last year you will find us in Hall 1, Booth 1-208. Our Co-Exhibitor Digilent Inc. and we are looking forward to your visit!
A lot of articles from Digilent are reduced now.
Trenz Electronic's FPGA System on Modules (SoMs) are currently available from Digi-Key Electronics, a global electronic components distributor, as part of a new global distribution agreement signed by the two companies.
04.10.2016 - The EU project TULIPP (Towards Ubiquitous Low-Power Image Processing Platforms) is an initiative for energy-efficient embedded systems for complex image processing applications. TULIPP is financed by Horizon 2020, a research and innovation program of the European Union, with almost 4 million Euros.
The new EMC²-KU35 is a stackable FPGA module with Gen2 PCI Express interfaces that are “OneBank” compatible and has a VITA57.1 FMC I/O slot controlled by a Kintex UltraScale KU35 FPGA, and is fully supported by the latest Xilinx Vivado tools.
The Zybot Makes its Educational Debut
One of the Digilent fans implements Mandelbrot on Genesys 2 and 4K resolution application on Nexys Video. These two projects are open source.
TULIPP Towards Ubiquitous Low-power Image Processing Platforms
Targets complex multi-tasking embedded system designs in automotive, broadcast, communications, industrial, medical, mil/aero, and test & measurement markets