SoC Module with Altera® Agilex™ 5E, 2 GB LPDDR4 SDRAM, 5.2 x 7.6 cm

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US$770.71

Possible to order, delivery time on request.

Article number: TEI0187-02-T4E111A

Article status: Full production

Stock: 0

Quantity	Unit price
To 9	US$770.71
From 10	US$693.64
From 25	US$693.64
From 50	US$616.57
From 100	US$578.03
From 250	US$578.03
From 500	US$516.38
From 1000	US$516.38

Product information "SoC Module with Altera® Agilex™ 5E, 2 GB LPDDR4 SDRAM, 5.2 x 7.6 cm"

The Trenz Electronic TEI0187-02-T4E111A is a powerful System-on-Module, equipped with an Altera^® Agilex™ 5E SoC. Furthermore, the board is equipped with 2 GByte DDR4 SDRAM and 256 MByte QSPI Flash for configuration and data storage as well as powerful switching power supplies for all required voltages. A large number of inputs and outputs are provided by robust, flexible and cost-effective high-speed connectors.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

FPGA/SoC
- Agilex™ 5 SoC E-Series Device Group B (A5ED065BB32AE4S)
  - B32A package (32mm x 32mm, 0.65mm, Variable Pitch FPGA)
- As assembly variant on request possible:
  - Package B32A (32x32 mm, 1591 balls) compatible device :
    - Device Group A, Specification C,D → A5E 013A, A5E 028A, A5E 043A, A5E 052A, A5E A5E 065A
    - Device Group B, Specification A,B,C,D,E → A5E 013B, A5E 028B, A5E 043B, A5E 052B, A5E 065B (default)
RAM/Storage
- 1 x QSPI Flash, 2 Gbit (256 MByte)
- 1 GB LPDDR4 SDRAM (32Bit) for HPS (Expandable up to 4 GB)
- 1 GB LPDDR4 SDRAM (32Bit) for Fabric FPGA (Expandable up to 4 GB)
- 8 GB eMMC (Expandable up to 64 GB)
- 1 x 2 Kbit & 1 x 128 Kbit EEPROMs Memory
IO Resources:
- MGT* : up to 24 x transceivers (up to 28 Gbps)
- HSIO*: up to 96 differential /192 SE
- HVIO*: up to 120 SE
- HPS IO: 19 I/O (SDIO, UART, I2C, I3C, GPIOs)
  
  * depends FPGA assembly variants, IO resources could be changed
  
  IO Ressourcen des TEI0187-02
  
  Key 043A/043B 052A/052B 065A/065B
  
  HVIO 120 120 120
  
  HSIO (Diff/SE) 96/192 96/192 96/192
  
  Transceivers
  
  Group A: max 16 Gbps
  
  Group B: max 28 Gbps
  16 24 24

Key	043A/043B	052A/052B	065A/065B
HVIO	120	120	120
HSIO (Diff/SE)	96/192	96/192	96/192
Transceivers Group A: max 16 Gbps Group B: max 28 Gbps	16	24	24

On-Board periphery
- Gigabit Ethernet PHY (RGMII)
- USB2.0 PHY (ULPI). Support USB3.1 Gen1 5Gbps (use 1 transceiver)
- TPM2.0
- Clocks for LPDDR4 SDRAM, GigE PHY, USB PHY, SDM FPGA
- SD3.0 (optional)
- B2B connection: Plug-on-module with 3 x 240-pin Samtec AccelerateHD (ADM6) connectors
Power
- 5V (12V) Power supply
Dimension
- 52 mm x 76 mm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Development Support

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

1 x TEI0187-02-T4E111A Trenz Electronic SoM with Altera® Agilex™ 5E device

Additional Information

Manufacturer's article number: TEI0187-02-T4E111A
Support Forum

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Downloads

Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products

File	File-Extension	Description
Bit-File	*.bit	FPGA Configuration File
Diverse Reports	--	Report files in different formats

File	File-Extension	Description
MCS-File	*.mcs	Flash Configuration File with Boot-Image (MicroBlaze or FPGA part only)
Bit-File	*.bit	FPGA Configuration File
Software-Application-File	*.elf	Software Application for Zynq or MicroBlaze Processor Systems
Hardware-Platform-Specification-Files	*.hdf	Hardware Specification from the vivado project. Used in SDK/HSI
MMI-File	*.mmi	File with BRAM-Location to generate MCS or BIT-File with *.elf content (MicroBlaze only)
Diverse Reports	--	Report files in different formats

Component	Description
Xilinx-IP	I2C,SPI-Flash,UART
TE-IP	ASIO (AXI-Stream to IO)

File	File-Extension	Description
MCS-File	*.mcs	Flash Configuration File with Boot-Image (MicroBlaze or FPGA part only)
BIT-File	*.bit	FPGA Configuration File
Software-Application-File	*.elf	Software Application for Zynq or MicroBlaze Processor Systems
Hardware-Platform-Specification-Files	*.hdf	Exported Vivado Hardware Specification for SDK/HSI
MMI-File	*.mmi	File with BRAM-Location to generate MCS or BIT-File with *.elf content (MicroBlaze only)
Diverse Reports	--	Report files in different formats

Component	Description
Xilinx-IP	VIO
TE-IP	Startupe2,LabTools Frequency Counter

Component	Description
Xilinx-IP	VIO (Virtual Input/Output)
TE-IP	Labtools Frequency Counter, Startupe2 Primitive Wrapper

Directory		Content
PCN		Product change notifications: Important changes between hardware revisions
Reference Design		Reference Designs sort by ISE/EDK Version
REV0x		Documents and source files sorted by PCB revision. Connector Pinout Viewer/XDC-Generator available on TE Master Pinout, as well as a additional informations on All Trenz Electronic SoMs
	Documents	PDF documents, like Technical Reference Manual, Schematics, Assembly Diagrams and...
	Firmware	Initial configuration for diverse PCB components, like CPLD, PLL and ...
	HW Design	Relevant files for PCB-Design, like PCB-STEP-Model, Cooler-STEP-Model, Trace-length, Altium libraries / projects (only for selected carrier boards), and ...
	Pictures	PCB-Pictures

Directory		Content
PCN		Product change notifications: Important changes between hardware revisions
REV0x		Documents and source files sorted by PCB revision. Connector Pinout Viewer/XDC-Generator available on TE Master Pinout, as well as a additional informations on All Trenz Electronic SoMs
	Documents	PDF documents, like Technical Reference Manual, Schematics, Assembly Diagrams and...
	Firmware	Initial configuration for diverse PCB components, like CPLD, PLL and ...
	HW Design	Relevant files for PCB-Design, like PCB-STEP-Model, Cooler-STEP-Model, Trace-length, Altium libraries / projects (only for selected carrier boards), and ...
	Pictures	PCB-Pictures

Component	Description
Xilinx-IP	MicroBlaze, MB-Debug, Uartlite, MIG7 for DDR3, QSPI, Timer, Ethernet Lite
TE-IP	ASIO GPIO (AXI-Stream to GPIO)

SoC Module with Altera® Agilex™ 5E, 2 GB LPDDR4 SDRAM, 5.2 x 7.6 cm

Product information "SoC Module with Altera® Agilex™ 5E, 2 GB LPDDR4 SDRAM, 5.2 x 7.6 cm"

Key Features

Development Support

Scope of Delivery

Additional Information

Downloads

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