MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

US$473.68

Ready to ship today, Delivery time appr. 1-3 workdays

Article number: TE0813-02-3AE81-A

Standard leadtime (weeks): 25

Article status: Upgrade available

Stock: 83

Quantity	Unit price
To 9	US$473.68
From 10	US$426.32
From 25	US$426.32
From 50	US$378.95
From 100	US$355.26
From 250	US$355.26
From 500	US$317.37
From 1000	US$317.37

Product information "MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm"

The predecessor of this article is TE0813-01-3AE11-A. All changes are in the Product Change Notification (PCN).

The TE0813 is largely identical in construction to the TE0803. The essential difference are new Samtec BGA connectors, which guarantees a reliable contact. The dimensions are identical.

The Trenz Electronic TE0813-02-3AE81-A is an industrial-grade MPSoC module integrating a AMD Zynq™ UltraScale+™ with ZU3CG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

SoC/FPGA
- Device: AMD Zynq™ UltraScale+™ XCZU3CG-1SFVC784E
- Speedgrade: -1
- Temperature range: Extended
- Package: SFVC784

RAM/Storage
- 4 GByte DDR4 SDRAM
- 128 MByte QSPI Boot Flash
- 2 Kbit serial EEPROM with EUI-48 Node Identity

On Board
- Oscillator
- Programmable 4-channel PLL clock generator

Interface
- Plug-on module with 4 x 240 pin B2B connectors (ADM6)
  - 204 PL IO
    - HP: 156
    - HD: 48
  - 65 PS MIO
  - 4 PS GTR
  - I2C, JTAG

Power
- 3.3V power supply required

Dimension
- 5.2 x 7.6 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Standard Edition (free version)

The Vivado Standard Edition is the FREE version of the Vivado design suite. Vivado Standard delivers instant access to some basic Vivado features and functionality at no cost.

Overview Vivado Standard and Enterprise Edition

Development Support

A carrier board and a test board are in development for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

1 x TE0813-02-3AE81-A Trenz Electronic MPSoC module with AMD Zynq™ UltraScale+™ ZU3CG

Additional Information

Manufacturer's article number: TE0813-02-3AE81-A
Trenz Electronic TE0813 Wiki
Support Forum

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Downloads

Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products

File	File-Extension	Description
Bit-File	*.bit	FPGA Configuration File
Diverse Reports	--	Report files in different formats

File	File-Extension	Description
MCS-File	*.mcs	Flash Configuration File with Boot-Image (MicroBlaze or FPGA part only)
Bit-File	*.bit	FPGA Configuration File
Software-Application-File	*.elf	Software Application for Zynq or MicroBlaze Processor Systems
Hardware-Platform-Specification-Files	*.hdf	Hardware Specification from the vivado project. Used in SDK/HSI
MMI-File	*.mmi	File with BRAM-Location to generate MCS or BIT-File with *.elf content (MicroBlaze only)
Diverse Reports	--	Report files in different formats

Component	Description
Xilinx-IP	I2C,SPI-Flash,UART
TE-IP	ASIO (AXI-Stream to IO)

File	File-Extension	Description
MCS-File	*.mcs	Flash Configuration File with Boot-Image (MicroBlaze or FPGA part only)
BIT-File	*.bit	FPGA Configuration File
Software-Application-File	*.elf	Software Application for Zynq or MicroBlaze Processor Systems
Hardware-Platform-Specification-Files	*.hdf	Exported Vivado Hardware Specification for SDK/HSI
MMI-File	*.mmi	File with BRAM-Location to generate MCS or BIT-File with *.elf content (MicroBlaze only)
Diverse Reports	--	Report files in different formats

Component	Description
Xilinx-IP	VIO
TE-IP	Startupe2,LabTools Frequency Counter

Component	Description
Xilinx-IP	VIO (Virtual Input/Output)
TE-IP	Labtools Frequency Counter, Startupe2 Primitive Wrapper

Directory		Content
PCN		Product change notifications: Important changes between hardware revisions
Reference Design		Reference Designs sort by ISE/EDK Version
REV0x		Documents and source files sorted by PCB revision. Connector Pinout Viewer/XDC-Generator available on TE Master Pinout, as well as a additional informations on All Trenz Electronic SoMs
	Documents	PDF documents, like Technical Reference Manual, Schematics, Assembly Diagrams and...
	Firmware	Initial configuration for diverse PCB components, like CPLD, PLL and ...
	HW Design	Relevant files for PCB-Design, like PCB-STEP-Model, Cooler-STEP-Model, Trace-length, Altium libraries / projects (only for selected carrier boards), and ...
	Pictures	PCB-Pictures

Directory		Content
PCN		Product change notifications: Important changes between hardware revisions
REV0x		Documents and source files sorted by PCB revision. Connector Pinout Viewer/XDC-Generator available on TE Master Pinout, as well as a additional informations on All Trenz Electronic SoMs
	Documents	PDF documents, like Technical Reference Manual, Schematics, Assembly Diagrams and...
	Firmware	Initial configuration for diverse PCB components, like CPLD, PLL and ...
	HW Design	Relevant files for PCB-Design, like PCB-STEP-Model, Cooler-STEP-Model, Trace-length, Altium libraries / projects (only for selected carrier boards), and ...
	Pictures	PCB-Pictures

Component	Description
Xilinx-IP	MicroBlaze, MB-Debug, Uartlite, MIG7 for DDR3, QSPI, Timer, Ethernet Lite
TE-IP	ASIO GPIO (AXI-Stream to GPIO)

MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm

Product information "MPSoC Module with AMD Zynq™ UltraScale+™ ZU3CG-1E, 4 GByte DDR4, 5.2 x 7.6 cm"

Key Features

Recommended Software

Development Support

Scope of Delivery

Additional Information

Downloads

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