Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05

US$22.56

Ready to ship today, Delivery time appr. 1-3 workdays

Article number: 33013

Stock: 156

Quantity	Unit price
To 9	US$22.56
From 10	US$20.30
From 25	US$19.17
From 50	US$18.05
From 100	US$16.92
From 250	US$15.79
From 500	US$14.66
From 1000	US$13.53

Product information "Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05"

Please check assembly instructions!

Wakefield-Vette's 27 x 27 x 23mm Pin Fin heat sink uses natural convection and thermal resistance of 9.44 °C/Watt.

The heatsink is mounted on the chipset.

Features

Heat sink with modified clip for precise fit on TE0741 (Revision 04/05)
Heat dissipation material: aluminum
Shape: Square, Pin Fins
Fin type: elliptical pin
Size: 27 x 27mm
Height from base (height of pins): 22.65 mm
Material Finish: Black Anodized
Weight per piece: ca. 18 g
Mounting method: Clip mounting

Scope of Delivery

1 x Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 and 05
1 x Heat conduction pad 25 x 25 mm

Additional Information

Manufacturer: Wakefield-Vette
Manufacturer's part number: 904-27-2-23-2-B-0
Download Data Sheet Pin Fin Heat Sink
Download Assembly Instructions
Overview modules TE0741 series
Trenz Electronic Wiki for 30313 heatsink
Trenz Electronic Wiki Cooling Solutions Overview
Support Forum

Downloads

Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products

File	File-Extension	Description
Bit-File	*.bit	FPGA Configuration File
Diverse Reports	--	Report files in different formats

File	File-Extension	Description
MCS-File	*.mcs	Flash Configuration File with Boot-Image (MicroBlaze or FPGA part only)
Bit-File	*.bit	FPGA Configuration File
Software-Application-File	*.elf	Software Application for Zynq or MicroBlaze Processor Systems
Hardware-Platform-Specification-Files	*.hdf	Hardware Specification from the vivado project. Used in SDK/HSI
MMI-File	*.mmi	File with BRAM-Location to generate MCS or BIT-File with *.elf content (MicroBlaze only)
Diverse Reports	--	Report files in different formats

Component	Description
Xilinx-IP	I2C,SPI-Flash,UART
TE-IP	ASIO (AXI-Stream to IO)

File	File-Extension	Description
MCS-File	*.mcs	Flash Configuration File with Boot-Image (MicroBlaze or FPGA part only)
BIT-File	*.bit	FPGA Configuration File
Software-Application-File	*.elf	Software Application for Zynq or MicroBlaze Processor Systems
Hardware-Platform-Specification-Files	*.hdf	Exported Vivado Hardware Specification for SDK/HSI
MMI-File	*.mmi	File with BRAM-Location to generate MCS or BIT-File with *.elf content (MicroBlaze only)
Diverse Reports	--	Report files in different formats

Component	Description
Xilinx-IP	VIO
TE-IP	Startupe2,LabTools Frequency Counter

Component	Description
Xilinx-IP	VIO (Virtual Input/Output)
TE-IP	Labtools Frequency Counter, Startupe2 Primitive Wrapper

Directory		Content
PCN		Product change notifications: Important changes between hardware revisions
Reference Design		Reference Designs sort by ISE/EDK Version
REV0x		Documents and source files sorted by PCB revision. Connector Pinout Viewer/XDC-Generator available on TE Master Pinout, as well as a additional informations on All Trenz Electronic SoMs
	Documents	PDF documents, like Technical Reference Manual, Schematics, Assembly Diagrams and...
	Firmware	Initial configuration for diverse PCB components, like CPLD, PLL and ...
	HW Design	Relevant files for PCB-Design, like PCB-STEP-Model, Cooler-STEP-Model, Trace-length, Altium libraries / projects (only for selected carrier boards), and ...
	Pictures	PCB-Pictures

Directory		Content
PCN		Product change notifications: Important changes between hardware revisions
REV0x		Documents and source files sorted by PCB revision. Connector Pinout Viewer/XDC-Generator available on TE Master Pinout, as well as a additional informations on All Trenz Electronic SoMs
	Documents	PDF documents, like Technical Reference Manual, Schematics, Assembly Diagrams and...
	Firmware	Initial configuration for diverse PCB components, like CPLD, PLL and ...
	HW Design	Relevant files for PCB-Design, like PCB-STEP-Model, Cooler-STEP-Model, Trace-length, Altium libraries / projects (only for selected carrier boards), and ...
	Pictures	PCB-Pictures

Component	Description
Xilinx-IP	MicroBlaze, MB-Debug, Uartlite, MIG7 for DDR3, QSPI, Timer, Ethernet Lite
TE-IP	ASIO GPIO (AXI-Stream to GPIO)

Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05

Product information "Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05"

Features

Scope of Delivery

Additional Information

Downloads

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