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Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05

Product information "Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05"

Please check assembly instructions!

Wakefield-Vette's 27 x 27 x 23mm Pin Fin heat sink uses natural convection and thermal resistance of 9.44 °C/Watt.

The heatsink is mounted on the chipset.

Features

  • Heat sink with modified clip for precise fit on TE0741 (Revision 04/05)
  • Heat dissipation material: aluminum
  • Shape: Square, Pin Fins
  • Fin type: elliptical pin
  • Size: 27 x 27mm
  • Height from base (height of pins): 22.65 mm
  • Material Finish: Black Anodized
  • Weight per piece: ca. 18 g
  • Mounting method: Clip mounting

Scope of Delivery

  • 1 x Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 and 05
  • 1 x Heat conduction pad 25 x 25 mm

Additional Information

Properties "Heat Sink for Trenz Electronic FPGA Modules TE0741 Revision 04 und 05"
Properties
Compatible with: TE0741-04, TE0741-05
Data according to manufacturer. Errors and changes reserved.

Downloads

Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference
Files SBSE____.ZZC
Size 4 B / Modified 29.09.2026 - 16:31:35

33013 - Heat Sink for TE0741-04 and TE0741-05

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