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MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm

Preferred type with short lead time Preferred standard item: produced continuously and usually available for quick delivery.

Product information "MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm"

The predecessor of this article is TE0817-01-7DI21-A. All changes are in the Product Change Notification (PCN).

The TE0817 is largely identical in construction to the TE0807. The essential difference are new Samtec BGA connectors, which guarantees a reliable contact. The dimensions are identical.

The Trenz Electronic TE0817-02-7DI81-A is a powerful MPSoC module integrating a AMD Zynq™ UltraScale+™ ZU7EV, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC/FPGA
    • Device: AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900I
    • Speedgrade: -1
    • Temperature range: Industrial
    • Package: FBVB900I
    • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • RAM/Storage
    • 4 GByte DDR4 SDRAM
    • 128 MByte QSPI Boot Flash
    • 2 Kbit MAC Adress serial EEPROM with EUI-48 Node Identity
  • On Board
    • Oscillator
  • Interface
    • 4 x B2B Connector (ADM6)
      • up to 204 PL IO
        • HP: 156
        • HD: 48
      • up to 65 PS MIO

      • 4 GTR
      • 16 GTH
      • I2C, JTAG
  • Power
    • Power supply via B2B Connector needed
  • Dimension
    • 5.2 x 7.6 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Standard Edition (free version)

The Vivado Standard Edition is the FREE version of the Vivado design suite. Vivado Standard delivers instant access to some basic Vivado features and functionality at no cost.

Overview Vivado Standard and Enterprise Edition

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0817-02-7DI81-A Trenz Electronic MPSoC Module with AMD Zynq™ UltraScale+™ ZU07EV

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Properties "MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1I, 4 GByte DDR4, 5.2 x 7.6 cm"
Properties
FPGA Manufacturer: AMD
FPGA/SoC Architecture: UltraScale+
FPGA/SoC Family: Zynq
FPGA/SoC Type: MPSoC
Form Factor: 5.2 × 7.6 cm
Data according to manufacturer. Errors and changes reserved.

Downloads

Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference

TE0817 - 5.2 x 7.6 cm MPSoC module with Xilinx Zynq UltraScale+

  • Shop TE0817 - contains prices, available stock, disposability, scope of delivery and more
  • Download area - various reference designs, schematics, hardware designs and more
  • Pinout/Tracelength Table - illustration of pinout, tracelength and cross reference Information of modules with different baseboards

5.6 x 7.6 Carrier

  • 5.2 x 7.6 Carriers - overview of available carrier boards for all <size x> x <size y> cm <type> modules

Support

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Accessories

Heatsink SuperGrip for Trenz Electronic REV05 only, TE0817 and TE0818
Heatsink SuperGrip for Trenz Electronic REV05 only, TE0817 and TE0818
High Performance maxiFLOW/superGRIP Heatsink, 31 x 31 x 17,5 mm, BGA Aluminium, top mounting
Article number: 29664
Stock: 10

Regular price: From US$27.91
Samtec ADF6 AcceleRate®High-Density 4-Row Socket, 240 Pins
Samtec ADF6 AcceleRate®High-Density 4-Row Socket, 240 Pins
ADF6-60-03.5-L-4-2-FR, 0.635 mm AcceleRate HD High-Density, 4-Row, 240 pins, slim body array
Article number: 31137
Stock: 652

Regular price: From US$4.28
Radian Sub-Zero PCIe Fansink - SZ12L, 50 x 64 x 10.5 mm, 12V
Radian Sub-Zero PCIe Fansink - SZ12L, 50 x 64 x 10.5 mm, 12V
Active aluminum heat sink with integrated 12V fan
Article number: 33663
Stock: 0

Regular price: From US$46.24
Radian Sub-Zero PCIe Fansink - SZ5L, 50 x 64 x 10.5 mm, 5V
Radian Sub-Zero PCIe Fansink - SZ5L, 50 x 64 x 10.5 mm, 5V
Active aluminum heat sink with integrated 5V fan
Article number: 33664
Stock: 23

Regular price: From US$46.24
Heat Spreader for Trenz Electronic MPSoC Module TE0817-02
Heat Spreader for Trenz Electronic MPSoC Module TE0817-02
Cooling solution especially desgined for Trenz Electronic MPSoC module TE0817-02
Article number: KK0817-02
Stock: 22

Regular price: From US$27.91
UltraITX+ Basisboard for Trenz Electronic TE081X UltraSOM+
UltraITX+ Basisboard for Trenz Electronic TE081X UltraSOM+
Baseboard developed for Trenz Electronic TE0813, TE0817 and TE0818 UltraSOM+ MPSoC modules.
Article number: TEBF0818-02A
Stock: 0

Regular price: US$617.61