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UltraSOM+ MPSoC-Modul mit AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4

Product information "UltraSOM+ MPSoC-Modul mit AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4"

The predecessor of this article is TE0808-05-BBE81-EK. All changes are in the Product Change Notification (PCN).

This module is a TE0808-06-BBE51-E plus mounted heat spreader.

This module will not be discontinued, but we recommend the TE0818 module series with an improved connector for new projects.

The Trenz Electronic TE0808-06-BBE51-E is a MPSoC module integrating a AMD Zynq™ UltraScale+™ ZU6EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x serial high speed transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • SoC/FPGA
    • Device: AMD Zynq™ UltraScale+™ ZU6EG-1FFVC900E
    • Speedgrade: -1
    • Temperature range: Extended
    • Package: FFVC900
    • Grafikprozessor-Unit (GPU)
  • RAM/Storage
    • 4 GByte DDR4 SDRAM
    • 2 x 64 MByte SPI Boot Flash (dual parallel)
    • 2 Kbit serial EEPROM with EUI-48 Node Identity
  • On Board
    • Oscillator
  • Interface
    • 4 x 160 pin B2B connectors (ST5)
      • 204 PL IO
        • HP: 156
        • HD: 48
      • 65 PS MIO

      • 4 PS GTR
      • 16 PL GTH
      • I2C, JTAG, CONFIG
    • 2 Transceiver clocks
    • PLL Clock Generator
    • LP, FP, PL separately controlled power domains
  • Power
    • 3.3 V power supply via B2B Connector needed
  • Dimension
    • 5.2 x 7.6 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

Recommended Software

Vivado Enterprise Edition (paid version)

The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.

Overview Vivado Standard and Enterprise Edition

Development Support

There is a base board available for this module.

Latest documentation, design support files and reference designs with source files are available for download free of charge.

Scope of Delivery

  • 1 x TE0808-06-BBE51-E Trenz Electronic MPSoC module with AMD Zynq™ UltraScale+™ ZU6EG
  • 1 x mounted heat spreader KK0808-05

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Properties "UltraSOM+ MPSoC-Modul mit AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GByte DDR4"
Properties
FPGA Manufacturer: AMD
FPGA/SoC Architecture: UltraScale+
FPGA/SoC Family: Zynq
FPGA/SoC Type: MPSoC
Data according to manufacturer. Errors and changes reserved.

Downloads

Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference

TE0808 - 5.2 x 7.6 cm MPSoC module with Xilinx Zynq UltraScale+

  • Shop TE0808 - contains prices, available stock, disposability, scope of delivery and more
  • Download area - various reference designs, schematics, hardware designs and more
  • Pinout/Tracelength Table - illustration of pinout, tracelength and cross reference Information of modules with different baseboards

5.2 x 7.6 Carrier

  • 5.2 x 7.6 Carriers - overview of available carrier boards for all 5.2 x 7.6 cm UltraSoM+ modules

Starter Kit

Support

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Accessories

Samtec Ultra Fine Pitch Socket REF192552-01, 160 Pins
Samtec Ultra Fine Pitch Socket REF192552-01, 160 Pins
SS5 series, Board-to-Board connector 160-pins, 80 contacts per row, 3.5 mm pin height
Article number: 27219
Stock: 0

Regular price: From US$5.71
Heatsink SuperGrip for Trenz Electronic REV05 only, TE0817 and TE0818
Heatsink SuperGrip for Trenz Electronic REV05 only, TE0817 and TE0818
High Performance maxiFLOW/superGRIP Heatsink, 31 x 31 x 17,5 mm, BGA Aluminium, top mounting
Article number: 29664
Stock: 10

Regular price: From US$27.91
Radian Sub-Zero PCIe Fansink - SZ12L, 50 x 64 x 10.5 mm, 12V
Radian Sub-Zero PCIe Fansink - SZ12L, 50 x 64 x 10.5 mm, 12V
Active aluminum heat sink with integrated 12V fan
Article number: 33663
Stock: 0

Regular price: From US$46.24
Radian Sub-Zero PCIe Fansink - SZ5L, 50 x 64 x 10.5 mm, 5V
Radian Sub-Zero PCIe Fansink - SZ5L, 50 x 64 x 10.5 mm, 5V
Active aluminum heat sink with integrated 5V fan
Article number: 33664
Stock: 23

Regular price: From US$46.24
UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+
UltraITX+ Baseboard for Trenz Electronic TE080X UltraSOM+
Baseboard developed for Trenz Electronic TE0803, TE0807 and TE0808 UltraSOM+ MPSoC modules.
Article number: TEBF0808-05
Stock: 0

Regular price: US$677.11