UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E incl. Heat Spreader
US$2,144.19
Possible to order, delivery time on request.
| Quantity | Unit price |
|---|---|
| To 9 |
US$2,144.19
|
| From 10 |
US$1,929.77
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| From 25 |
US$1,929.77
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| From 50 |
US$1,715.35
|
| From 100 |
US$1,608.14
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| From 250 |
US$1,608.14
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| From 500 |
US$1,436.61
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| From 1000 |
US$1,436.61
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Product information "UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU15EG-1E incl. Heat Spreader"
The predecessor of this article is TE0808-05-BBE21-AK. All changes are in the Product Change Notification (PCN).
This module is a TE0808-05-BBE81-E with mounted heat spreader.
This module will not be discontinued, but we recommend the TE0818 module series with an improved connector for new projects.
The Trenz Electronic TE0808-05-BBE81-E is a MPSoC module integrating a AMD Zynq™ UltraScale+™ ZU15EG, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x serial high speed transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.
All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.
All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Key Features
- SoC/FPGA
- Device: AMD Zynq™ UltraScale+™ XCZU15EG-1FFVC900E
- Speedgrade: -1
- Temperature range: Extended
- Package: FFVC900
- Grafikprozessor-Unit (GPU)
- RAM/Storage
- 4 GByte DDR4 SDRAM
- 2 x 64 MByte SPI Boot Flash (dual parallel)
- 2 Kbit serial EEPROM with EUI-48 Node Identity
- On Board
- Oscillator
- Interface
- 4 x 160 pin B2B connectors (ST5)
- 204 PL IO
- HP: 156
- HD: 48
-
65 PS MIO
- 4 PS GTR
- 16 PL GTH
- I2C, JTAG, CONFIG
- 204 PL IO
- 2 Transceiver clocks
- PLL Clock Generator
- LP, FP, PL separately controlled power domains
- 4 x 160 pin B2B connectors (ST5)
- Power
- 3.3 V power supply via B2B Connector needed
- Dimension
- 5.2 x 7.6 cm
- 5.2 x 7.6 cm
Other assembly options for cost or performance optimization plus high volume prices available on request.
Recommended Software
Vivado Enterprise Edition (paid version)
The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.
Development Support
There is a base board available for this module.
Latest documentation, design support files and reference designs with source files are available for download free of charge.
Scope of Delivery
- 1 x TE0808-05-BBE81-E Trenz Electronic MPSoC module with AMD Zynq™ UltraScale+™ ZU15EG
- 1 x mounted heat spreader KK0808-05
Additional Information
- Manufacturer's article number: TE0808-05-BBE81-EK
- Trenz Electronic TE0808 Wiki
- Trenz Electronic KK0808 Wiki
- Support Forum
All modules produced by Trenz Electronic are developed and manufactured in Germany.
TE0808 - 5.2 x 7.6 cm MPSoC module with Xilinx Zynq UltraScale+
- TE0808 - UltraSoM+ - Wiki with TRM, reference projects, application notes and more
- TE0808 TRM - Technical Reference Manual
- TE0808 Reference Designs - Reference Design Description for Vivado 2017.2 and newer
- TE0808 Product Change Notifications - PCN (see also Schematic Change History and TRM)
- 5.2 x 7.6 UltraSoM+ ST5 and SS5 B2B Connectors - overview, compatibility, mating heights and speed rating
- 5.2 x 7.6 UltraSoM+ Integration Guide - module and carrier board power connection, PCB Design notes and more
- TEBF0808 Getting Started - Basic note to start up Carrier with TE080x modules
Links
- Shop TE0808 - contains prices, available stock, disposability, scope of delivery and more
- Download area - various reference designs, schematics, hardware designs and more
- Pinout/Tracelength Table - illustration of pinout, tracelength and cross reference Information of modules with different baseboards
5.2 x 7.6 Carrier
- 5.2 x 7.6 Carriers - overview of available carrier boards for all 5.2 x 7.6 cm UltraSoM+ modules
Starter Kit
- Starter Kit 808 - module with carrier, enclosure and more
3rd Party Links
- Design Time and Run Time Resources for Zynq Ultrascale+ TE0808-04-15EG-1EE with SDSoC 2018.2 Support - provided by UTIA
- FitOptiVis From the cloud to the edge - smart IntegraTion and OPtimization Technologies for highly efficient Image and VIdeo processing Systems - provided by UTIA
- Arrowhead Tools Arrowhead Tools for Engineering of Digitalisation Solutions - provided by UTIA
- Testing all Samples from Xilinx Vitis AI Library 2.0 on Trenz Electronic board TE0808 SoM + TEBF0808 Carrier - provided by UTIA
- All VART Examples from Xilinx Vitis AI 2.0 for Trenz Electronic board TE0808 SoM + TEBF0808 Carrier - provided by UTIA
- Xilinx Vitis AI 'facedetect' Demo on Trenz Electronic board TE0808 SoM + TEBF0808 Carrier - provided by UTIA
Support
- For support, please go to http://forum.trenz-electronic.de/ or contact support@trenz-electronic.de