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Starter Kit with AMD Zynq™ UltraScale+™ ZU7EV-1E MPSoC Module

Product information "Starter Kit with AMD Zynq™ UltraScale+™ ZU7EV-1E MPSoC Module"

The Trenz Electronic Starter Kit TE0817-02-7DE81-AS consists of a TE0817-02-7DE81-A module with ZU7EV on a TEBF0818-02 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400 W power supply for the enclosure, two mounted XMOD FTDI JTAG Adapter, an 32 GB micro SD card, an USB cable, a power cable and screws.

The Module: TE0817-02-7DE81-A

The Trenz Electronic TE0817-02-7DE81-A is a powerful MPSoC module integrating a AMD Zynq™ UltraScale+™ ZU7EV, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

Key Features

  • SoC/FPGA
    • Device: AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E
    • Speedgrade: -1
    • Temperature range: Extended
    • Package: FBVB900E
    • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • RAM/Storage
    • 4 GByte DDR4 SDRAM
    • 2 x 64 MByte QSPI Boot Flash
    • 2 Kbit MAC Adress serial EEPROM with EUI-48 Node Identity
  • On Board
    • Oscillator
  • Interface
    • 4 x B2B Connector (ADM6)
      • up to 204 PL IO
        • HP: 156
        • HD: 48
      • up to 65 PS MIO

      • 4 GTR
      • 16 GTH
      • I2C, JTAG
  • Power
    • Power supply via B2B Connector needed
  • Dimension
    • 5.2 x 7.6 cm

Recommended Software

Vivado Enterprise Edition (paid version)

The Vivado Enterprise Edition is the full-featured version of the design suite and supports all AMD devices.

Overview Vivado Standard and Enterprise Edition

 

The Base Board: TEBF0818-02A

The Trenz Electronic TEBF0818 UltraITX+ base board has been developed individually for the TE081x MPSoC series.

Key Features

  • Mini-ITX form factor, PC enclosure compatible
  • ATX-24 power supply connector
  • Optional 12V standard power plug
  • Headers
    • Intel 10-pin HDA audio
    • Intel 9-pin power/reset button, Power-/HD-LED
    • PC-BEEPER
  • On-board power-/reset-switches
  • 2 x configuration 4-bit DIP switches
  • 2 x optional 4-wire PWM fan connectors
  • PCIe slot - one PCIe lane (16 lane connector)
  • CAN FD transceiver (10 Pin IDC connector and 6-pin header)
  • 4 x On-board configuration EEPROMs (1 x Microchip 24LC128-I/ST, 3 x Microchip 24AA025E48T-I/OT)
  • Dual SFP+ connector (2x1 Cage)
  • 1 x DisplayPort (single lane)
  • 1 x SATA connector
  • 2 x USB 3.0 A connector (Superspeed Host Port (Highspeed at USB 2.0))
  • 1 x USB 3.0 on-board connector with two ports
  • FMC HPC slot (FMC_VADJ max. VCCIO)
  • FMC fan
  • Gigabit Ethernet RGMII PHY with RJ45 MagJack
  • All carrier board peripherals' I²C interfaces muxed to MPSoC's I²C interface
  • Quad programmable PLL clock generator
  • 2 x SMA coaxial connectors for clock signals
  • MicroSD/MMC card socket (bootable)
  • 64 GBit (8 GByte) on-board eMMC Flash
  • 2 x System controller CPLDs Lattice MachXO2 1200 HC
  • 1 x Samtec FireFly (4 GT lanes bidirectional)
  • 1 x Samtec FireFly connector for reverse loopback
  • 20-pin ARM JTAG connector (PS JTAG0)
  • 3 x Pmod connector (GPIO's and I²C interface to SC CPLDs and MPSoC module)
  • On-board DC-DC PowerSoCs
  • Size: 170 mm × 170 mm. Please download the assembly diagram for exact details.
  • Mating height with standard connectors: 5 mm

PC Enclosure Accessible I/O

  • PCIe
  • FMC
  • Dual SFP+
  • RJ45 Gigabit Ethernet
  • 2 x USB3 Host
  • Displayport
  • microSD
  • Two LEDs
  • CAN FD (using DB9 to IDC10 Cable)

Kolink Satellite Mini-ITX/Micro-ATX Case - Technical Specifications

  • Dimensions: 260 x 190 x 280 mm (W x H x D)
  • 0.5 mm steel + plastic case
  • Weight: 2 kg
  • Low space requirement
  • 2 x USB 3.0 ports on the front
  • Support for Micro-ATX motherboards
  • Support for 280 mm VGA cards
  • Black interior with 120 mm fan installed at the rear

Scope of Delivery - Starter Kit

  • 1 x Kolink Satellite Mini-ITX / Micro-ATX case - black
  • 1 x Power supply Be Quiet! 300 Watt be quiet! SFX Power 3 80+ Bronze
  • 1 x TE0817-02-7DE81-A MPSoC module with AMD Zynq™ UltraScale+™ ZU7EV
  • 1 x TEBF0818-02A base board
  • 1 x Heatsink SuperGrip ATS-X50310P-C1-R0 31 x 31 x 17,5 mm (Article no. 29664)
  • 1 x TE0790-03 XMOD FTDI JTAG adapter (compatible with AMD-Tools), pre-assembled on the carrier board
  • 1 x TE0790-03L XMOD FTDI JTAG adapter (independent from AMD-Tools), pre-assembled on the carrier board
  • 1 x 32 GB Class 10 UHS1 microSDHC incl. adapter
  • 1 x USB cable, Type A to Type B Mini
  • 1 x power cable Schuko black

Additional Information

All modules produced by Trenz Electronic are developed and manufactured in Germany.

Properties "Starter Kit with AMD Zynq™ UltraScale+™ ZU7EV-1E MPSoC Module"
Properties
FPGA Manufacturer: AMD
FPGA/SoC Architecture: UltraScale+
FPGA/SoC Family: Zynq
FPGA/SoC Type: MPSoC
Form Factor: Mini-ITX
Data according to manufacturer. Errors and changes reserved.

Downloads

Digilent
OHO-Elektronik
Sundance
Trenz_Electronic - Documents and Design files for Trenz Electronic Products
inrevium
reference

TE0817 - 5.2 x 7.6 cm MPSoC module with Xilinx Zynq UltraScale+

  • Shop TE0817 - contains prices, available stock, disposability, scope of delivery and more
  • Download area - various reference designs, schematics, hardware designs and more
  • Pinout/Tracelength Table - illustration of pinout, tracelength and cross reference Information of modules with different baseboards

5.6 x 7.6 Carrier

  • 5.2 x 7.6 Carriers - overview of available carrier boards for all <size x> x <size y> cm <type> modules

Support

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Accessories

Heat Sink SuperGrip for Trenz Electronic MPSoC Modules TE0803 and TE0813
Heat Sink SuperGrip for Trenz Electronic MPSoC Modules TE0803 and TE0813
High Performance maxiFLOW/superGRIP Heat Sink, 23 x 23 x 7,5 mm, BGA Aluminium, top mounting
Article number: 29665
Stock: 0

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Radian Sub-Zero PCIe Fansink - SZ12L, 50 x 64 x 10.5 mm, 12V
Radian Sub-Zero PCIe Fansink - SZ12L, 50 x 64 x 10.5 mm, 12V
Active aluminum heat sink with integrated 12V fan
Article number: 33663
Stock: 0

Regular price: From US$46.24
Radian Sub-Zero PCIe Fansink - SZ5L, 50 x 64 x 10.5 mm, 5V
Radian Sub-Zero PCIe Fansink - SZ5L, 50 x 64 x 10.5 mm, 5V
Active aluminum heat sink with integrated 5V fan
Article number: 33664
Stock: 23

Regular price: From US$46.24
Heat Spreader for Trenz Electronic MPSoC Module TE0817-02
Heat Spreader for Trenz Electronic MPSoC Module TE0817-02
Cooling solution especially desgined for Trenz Electronic MPSoC module TE0817-02
Article number: KK0817-02
Stock: 27

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MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm
MPSoC Module with AMD Zynq™ UltraScale+™ ZU7EV-1E, 4 GByte DDR4, 5.2 x 7.6 cm
AMD Zynq™ UltraScale+™ XCZU7EV-1FBVB900E, 4 GByte DDR4, 128 MByte QSPI Boot Flash, size: 5.2 x 7.6 cm
Article number: TE0817-02-7DE81-A
Stock: 0

Regular price: From US$1,753.80